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參數資料
| 型號： | ISP1102W |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通用總線功能 |
| 英文描述： | Advanced Universal Serial Bus transceiver |
| 中文描述： | LINE TRANSCEIVER, PQCC16 |
| 封裝： | 3 X 3 MM, 0.65 MM HEIGHT, HALOGEN FREE, PLASTIC, MO-217, SOT-639-2, HBCC-16 |
| 文件頁數： | 20/23頁 |
| 文件大小： | 533K |
| 代理商： | ISP1102W |
Philips Semiconductors
ISP1102
Advanced USB transceiver
Product data
Rev. 03 — 02 September 2003
20 of 23
9397 750 11228
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
°
C or
265
°
C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in
most applications.
16.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°
C.
16.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[2]
[3]
[4]
Table 16:
Suitability of surface mount IC packages for wave and reflow soldering
methods
Soldering method
Wave
BGA, LBGA, LFBGA, SQFP, SSOP-T
[3]
,
TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP,
HSOP, HTQFP, HTSSOP, HVQFN, HVSON,
SMS
PLCC
[5]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
PMFP
[8]
Package
[1]
Reflow
[2]
suitable
not suitable
not suitable
[4]
suitable
suitable
not recommended
[5][6]
not recommended
[7]
not suitable
suitable
suitable
suitable
not suitable
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相關代理商/技術參數 |
參數描述 |
|---|---|
| ISP1102W,115 | 功能描述:射頻收發(fā)器 USB FULL SPD TRNSCVR RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數據速率:2000 Kbps 調制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1102W,118 | 功能描述:射頻收發(fā)器 USB FULL SPD TRNSCVR RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數據速率:2000 Kbps 調制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1102W-G | 功能描述:射頻收發(fā)器 USB FULL SPD TRNSCVR RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數據速率:2000 Kbps 調制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1102W-T | 功能描述:射頻收發(fā)器 USB FULL SPD TRNSCVR RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數據速率:2000 Kbps 調制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1102WTS | 功能描述:IC USB TXRX 12MBITS 16-HBCC RoHS:是 類別:集成電路 (IC) >> 接口 - 驅動器，接收器，收發(fā)器 系列:- 標準包裝:98 系列:* |
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