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參數(shù)資料
| 型號： | ISL97646IRZ-T |
| 廠商： | INTERSIL CORP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | Boost + LDO + VON Slice + VCOM |
| 中文描述： | 3.1 A SWITCHING REGULATOR, 1400 kHz SWITCHING FREQ-MAX, PQCC24 |
| 封裝： | 4 X 4 MM, ROHS COMPLIANT, PLASTIC, QFN-24 |
| 文件頁數(shù)： | 14/15頁 |
| 文件大小： | 450K |
| 代理商： | ISL97646IRZ-T |
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reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
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FN6265.0
December 21, 2006
Layout Recommendation
The device’s performance including efficiency, output noise,
transient response and control loop stability is dramatically
affected by the PCB layout. PCB layout is critical, especially
at high switching frequency.
There are some general guidelines for layout:
1. Place the external power components (the input
capacitors, output capacitors, boost inductor and output
diodes, etc.) in close proximity to the device. Traces to
these components should be kept as short and wide as
possible to minimize parasitic inductance and resistance.
2. Place V
IN
and VDD bypass capacitors close to the pins.
3. Reduce the loop area with large AC amplitudes and fast
slew rate.
4. The feedback network should sense the output voltage
directly from the point of load, and be as far away from LX
node as possible.
5. The power ground (PGND) and signal ground (SGND)
pins should be connected at only one point.
6. The exposed die plate, on the underneath of the
package, should be soldered to an equivalent area of
metal on the PCB. This contact area should have multiple
via connections to the back of the PCB as well as
connections to intermediate PCB layers, if available, to
maximize thermal dissipation away from the IC.
7. To minimize the thermal resistance of the package when
soldered to a multi-layer PCB, the amount of copper track
and ground plane area connected to the exposed die
plate should be maximized and spread out as far as
possible from the IC. The bottom and top PCB areas
especially should be maximized to allow thermal
dissipation to the surrounding air.
8. A signal ground plane, separate from the power ground
plane and connected to the power ground pins only at the
exposed die plate, should be used for ground return
connections for control circuit.
9. Minimize feedback input track lengths to avoid switching
noise pick-up.
A demo board is available to illustrate the proper layout
implementation.
ISL97646
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISL97646IRZ-TK | 功能描述:直流/直流開關(guān)調(diào)節(jié)器 ISL97646IRZOOST +L DO +VON SLICE +VCOM RoHS:否 制造商:International Rectifier 最大輸入電壓:21 V 開關(guān)頻率:1.5 MHz 輸出電壓:0.5 V to 0.86 V 輸出電流:4 A 輸出端數(shù)量: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN 4 x 5 |
| ISL97648IRTZ | 功能描述:IC BOOST DC/DC REG RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 專用型 系列:- 標(biāo)準(zhǔn)包裝:2,000 系列:- 應(yīng)用:控制器，DSP 輸入電壓:4.5 V ~ 25 V 輸出數(shù):2 輸出電壓:最低可調(diào)至 1.2V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:30-TFSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:30-TSSOP 包裝:帶卷 (TR) |
| ISL97648IRTZ-T | 制造商:Intersil Corporation 功能描述:HIGH VOLTAGE TFT-LCD LOGIC DRIVER (56 LD TQFN 8X8) - Tape and Reel |
| ISL97648IRTZ-TK | 制造商:Intersil Corporation 功能描述:HIGH VOLTAGE TFT-LCD LOGIC DRIVER (56 LD TQFN 8X8) - Tape and Reel |
| ISL97649AIRZ | 功能描述:PMIC 解決方案 LCD SUPPLY DCP VCOM AMP BPMSET +LDO 28L RoHS:否 制造商:Texas Instruments 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-24 封裝:Reel |
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