All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certificatio" />
參數資料
型號: ISL90462UIH627Z-TK
廠商: Intersil
文件頁數: 7/7頁
文件大?。?/td> 0K
描述: IC XDCP 32-TAP 50KOHM SOT23-6
標準包裝: 1,000
系列: XDCP™
接片: 32
電阻(歐姆): 50k
電路數: 1
溫度系數: 標準值 ±35 ppm/°C
存儲器類型: 易失
接口: 2 線串行(芯片選擇,增/減)
電源電壓: 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: SOT-23-6
供應商設備封裝: SOT-23-6
包裝: 帶卷 (TR)
7
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8230.3
October 7, 2005
ISL90462
Small Outline Transistor Plastic Packages (SC70-6)
D
e1
E
C
L
e
b
C
L
A2
A
A1
C
L
0.20 (0.008) M
0.10 (0.004) C
C
-C-
SEATING
PLANE
12
3
4
5
6
E1
C
L
C
VIEW C
L
R1
R
4X
θ1
4X
θ1
GAUGE PLANE
L1
SEATING
α
L2
C
PLANE
c
BASE METAL
WITH
c1
b1
PLATING
b
P6.049
6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.031
0.043
0.80
1.10
-
A1
0.000
0.004
0.00
0.10
-
A2
0.031
0.039
0.00
1.00
-
b
0.006
0.012
0.15
0.30
-
b1
0.006
0.010
0.15
0.25
c
0.003
0.009
0.08
0.22
6
c1
0.003
0.009
0.08
0.20
6
D
0.073
0.085
1.85
2.15
3
E
0.071
0.094
1.80
2.40
-
E1
0.045
0.053
1.15
1.35
3
e
0.0256 Ref
0.65 Ref
-
e1
0.0512 Ref
1.30 Ref
-
L
0.010
0.018
0.26
0.46
4
L1
0.017 Ref.
0.420 Ref.
L2
0.006 BSC
0.15 BSC
N6
6
5
R
0.004
-
0.10
-
R1
0.004
0.010
0.15
0.25
α
0o
8o
0o
8o
-
Rev. 2 9/03
NOTES:
1. Dimensioning and tolerance per ASME Y14.5M-1994.
2. Package conforms to EIAJ SC70 and JEDEC MO203AB.
3. Dimensions D and E1 are exclusive of mold flash, protrusions,
or gate burrs.
4. Footlength L measured at reference to gauge plane.
5. “N” is the number of terminal positions.
6. These Dimensions apply to the flat section of the lead between
0.08mm and 0.15mm from the lead tip.
7. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only
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參數描述
ISL90462WIE627-TK 功能描述:IC XDCP 32-TAP 10KOHM SC70-6 RoHS:否 類別:集成電路 (IC) >> 數據采集 - 數字電位器 系列:XDCP™ 標準包裝:2,500 系列:XDCP™ 接片:256 電阻(歐姆):100k 電路數:1 溫度系數:標準值 ±300 ppm/°C 存儲器類型:非易失 接口:I²C(設備位址) 電源電壓:2.7 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應商設備封裝:14-TSSOP 包裝:帶卷 (TR)
ISL90462WIE627Z-TK 功能描述:IC XDCP 32-TAP 10KOHM SC70-6 RoHS:是 類別:集成電路 (IC) >> 數據采集 - 數字電位器 系列:XDCP™ 標準包裝:3,000 系列:DPP 接片:32 電阻(歐姆):10k 電路數:1 溫度系數:標準值 300 ppm/°C 存儲器類型:非易失 接口:3 線串行(芯片選擇,遞增,增/減) 電源電壓:2.5 V ~ 6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-WFDFN 裸露焊盤 供應商設備封裝:8-TDFN(2x3) 包裝:帶卷 (TR)
ISL90462WIH627-TK 功能描述:IC XDCP 32-TAP 10KOHM SOT23-6 RoHS:否 類別:集成電路 (IC) >> 數據采集 - 數字電位器 系列:XDCP™ 標準包裝:2,500 系列:XDCP™ 接片:256 電阻(歐姆):100k 電路數:1 溫度系數:標準值 ±300 ppm/°C 存儲器類型:非易失 接口:I²C(設備位址) 電源電壓:2.7 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應商設備封裝:14-TSSOP 包裝:帶卷 (TR)
ISL90462WIH627Z-TK 功能描述:IC XDCP 32-TAP 10KOHM SOT23-6 RoHS:是 類別:集成電路 (IC) >> 數據采集 - 數字電位器 系列:XDCP™ 標準包裝:3,000 系列:DPP 接片:32 電阻(歐姆):10k 電路數:1 溫度系數:標準值 300 ppm/°C 存儲器類型:非易失 接口:3 線串行(芯片選擇,遞增,增/減) 電源電壓:2.5 V ~ 6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-WFDFN 裸露焊盤 供應商設備封裝:8-TDFN(2x3) 包裝:帶卷 (TR)
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