FN6046.8 February 28, 2006 ISL8483, ISL8485, ISL8488, ISL8489, ISL8490, ISL8491 Small Outline Plastic Packages (SOIC) INDEX AREA " />
參數(shù)資料
型號: ISL8491IP
廠商: Intersil
文件頁數(shù): 7/16頁
文件大?。?/td> 0K
描述: IC TXRX RS485/422 5V ESD 14-DIP
標準包裝: 25
類型: 收發(fā)器
驅動器/接收器數(shù): 1/1
規(guī)程: RS422,RS485
電源電壓: 4.5 V ~ 5.5 V
安裝類型: 通孔
封裝/外殼: 14-DIP(0.300",7.62mm)
供應商設備封裝: 14-PDIP
包裝: 管件
15
FN6046.8
February 28, 2006
ISL8483, ISL8485, ISL8488, ISL8489, ISL8490, ISL8491
Small Outline Plastic Packages (SOIC)
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H
0.25(0.010)
B
M
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N8
8
7
α
-
Rev. 1 6/05
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