
4
FN6050.7
July 31, 2006
Absolute Maximum Ratings
Thermal Information
V
CC
to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (V
CC
+0.5V)
Input/Output Voltages
A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (V
CC
+0.5V)
Short Circuit Duration
Y, Z. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating
HBM (Per MIL-STD-883, Method 3015.7) . . . . . . . . . . . . . . >7kV
Operating Conditions
Temperature Range
ISL8XXXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
Thermal Resistance (Typical, Note 1)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
8 Ld PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Junction Temperature (Plastic Package) . . . . . . . 150°C
Maximum Storage Temperature Range. . . . . . . . . . .-65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
*Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
θ
JA
(°C/W)
170
140
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θ
JA
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: V
CC
= 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at V
CC
= 5V, T
A
= 25°C,
(Note 2)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(
°
C)
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Driver Differential V
OUT
(no load)
Driver Differential V
OUT
(with load)
V
OD1
V
OD2
Full
-
-
V
CC
-
V
R = 50
Ω
(RS-422), (Figure 1)
Full
2
3
V
R = 27
Ω
(RS-485), (Figure 1)
Full
1.5
2.3
5
V
Change in Magnitude of Driver
Differential V
OUT
for
Complementary Output States
Δ
V
OD
R = 27
Ω
or 50
Ω
, (Figure 1)
Full
-
0.01
0.2
V
Driver Common-Mode V
OUT
Change in Magnitude of Driver
Common-Mode V
OUT
for
Complementary Output States
V
OC
Δ
V
OC
R = 27
Ω
or 50
Ω
, (Figure 1)
Full
-
-
3
V
R = 27
Ω
or 50
Ω
, (Figure 1)
Full
-
0.01
0.2
V
Logic Input High Voltage
V
IH
V
IL
I
IN1
I
IN2
DE, DI, RE
Full
2
-
-
V
Logic Input Low Voltage
DE, DI, RE
Full
-
-
0.8
V
Logic Input Current
DE, DI, RE
Full
-2
-
2
μ
A
Input Current (A/Y, B/Z), (Note 10)
(ISL81483, ISL81487)
DE = 0V, V
CC
= 4.5 to
5.5V
V
IN
= 12V
V
IN
= -7V
V
IN
= 12V
V
IN
= -7V
V
IN
= 12V
V
IN
= -7V
Full
-
-
140
μ
A
Full
-
-
-120
μ
A
I
IN2
DE = 0V, V
CC
= 0V
Full
-
-
180
μ
A
Full
-
-
-100
μ
A
Input Current (A/Y, B/Z), (Note 11)
(ISL8487 Only)
I
IN2
DE = 0V, V
CC
= 0V, or
4.5 to 5.5V
Full
-
-
250
μ
A
Full
-
-
-100
μ
A
Receiver Differential Threshold
Voltage
V
TH
-7V
≤
V
CM
≤
12V
Full
-0.2
-
0.2
V
Receiver Input Hysteresis
Δ
V
TH
V
OH
V
OL
I
OZR
V
CM
= 0V
I
O
= -4mA, V
ID
= 200mV
I
O
= -4mA, V
ID
= 200mV
0.4V
≤
V
O
≤
2.4V
25
-
70
-
mV
Receiver Output High Voltage
Full
3.5
-
-
V
Receiver Output Low Voltage
Full
-
-
0.4
V
Three-State (high impedance)
Receiver Output Current
Full
-
-
±
1
μ
A
ISL8487, ISL81483, ISL81487