
3
Absolute Maximum Ratings
Thermal Information
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V
Input Voltages
IN, NO, NC, COM (Note 2) . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
Continuous Current (NO, NC, or COM) . . . . . . . . . . . . . . . . . . 30mA
Peak Current NO, NC, or COM
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . 100mA
ESD Rating (Per MIL-STD-883 Method 3015). . . . . . . . . . . . . .>2kV
Operating Conditions
Temperature Range
ISL832XIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
o
C to 85
o
C
Thermal Resistance (Typical, Note 3)
8 LD SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Junction Temperature (Plastic Package). . . . . . . . 150
Moisture Sensitivity (See Technical Brief TB363)
All Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Storage Temperature Range . . . . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
(SOIC - Lead Tips Only)
θ
JA
(
o
C/W)
170
o
C
o
C to 150
o
o
C
C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. Signals on NC, NO, COM, or IN exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current ratings.
3.
θ
JA
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications - 5V Supply
Test Conditions: V+ = +4.5V to +5.5V, GND = 0V, V
Unless Otherwise Specified
INH
= 2.4V, V
INL
= 0.8V (Note 4),
PARAMETER
TEST CONDITIONS
TEMP
(
C)
o
MIN
(NOTE 5)
TYP
MAX
(NOTE 5)
UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, V
ANALOG
Full
0
-
V+
V
ON Resistance, R
ON
V+ = 4.5V, I
See Figure 5
COM
= 1.0mA, V
NO
or V
NC
= 3.5V,
25
-
-
60
Full
-
-
75
R
ON
R
ON
Matching Between Channels,
V+ = 5V, I
COM
= 1.0mA, V
NO
or V
NC
= 3V
25
-
0.8
2
Full
-
-
4
R
ON
Flatness, R
FLAT(ON)
V+ = 5V, I
COM
= 1.0mA, V
NO
or V
NC
= 1V, 2V, 3V
Full
-
7
8
nA
NO or NC OFF Leakage Current,
I
NO(OFF)
or I
NC(OFF)
V+ = 5.5V, V
Note 6
COM
= 1V, 4.5V, V
NO
or V
NC
= 4.5V, 1V,
25
-0.1
-
0.1
Full
-5
-
5
nA
COM OFF Leakage Current,
I
COM(OFF)
V+ = 5.5V, V
Note 6
COM
= 4.5V, 1V, V
NO
or V
NC
= 1V, 4.5V,
25
-0.1
-
0.1
nA
Full
-5
-
5
nA
COM ON Leakage Current,
I
COM(ON)
V
+
= 5.5V, V
COM
= 5V, or V
NO
or V
NC
= 5V, Note 6
25
-0.2
-
0.2
nA
Full
-10
-
10
nA
DYNAMIC CHARACTERISTICS
Turn-ON Time, t
ON
V
See Figure 1
NO
or V
NC
= 3V, R
L
=1k
, C
L
= 35pF, V
IN
= 0 to 3V,
25
-
-
150
ns
Full
-
-
240
ns
Turn-OFF Time, t
OFF
V
See Figure 1
NO
or V
NC
= 3V, R
L
=1k
, C
L
= 35pF, V
IN
= 0 to 3V,
25
-
-
100
ns
Full
-
-
150
ns
Break-Before-Make Time Delay
(ISL8325), t
D
Charge Injection, Q
R
See Figure 3
L
= 300
, C
L
= 35pF, V
NO
= V
NC
= 3V, V
IN
= 0 to 3V,
Full
2
10
-
ns
C
L
= 1.0nF, V
G
= 5pF, f = 1MHz, See Figure 4
= 0V, R
G
= 0
, See Figure 2
25
-
-
5
pC
OFF Isolation
R
L
= 50
, C
L
25
-
72
-
dB
Crosstalk (Channel-to-Channel)
R
L
= 50
, C
L
= 5pF, f = 1MHz, See Figure 6
25
-
-85
-
dB
NO or NC OFF Capacitance, C
OFF
f = 1MHz, V
NO
NO
or V
NC
= V
COM
= 0V, See Figure 7
or V
NC
= V
COM
= 0V, See Figure 7
25
-
9
-
pF
COM OFF Capacitance,
C
COM(OFF)
COM ON Capacitance, C
COM(ON)
POWER SUPPLY CHARACTERISTICS
f = 1MHz, V
25
-
9
-
pF
f = 1MHz, V
NO
or V
NC
= V
COM
= 0V, See Figure 7
25
-
22
-
pF
Power Supply Range
Full
2.7
12
V
Positive Supply Current, I+
V+ = 5.5V, V
IN
= 0V or V+, all channels on or off
Full
-1
0.0001
1
μ
A
ISL8323, ISL8324, ISL8325