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參數(shù)資料
| 型號： | ISL83088EIBZ-T |
| 廠商： | Intersil |
| 文件頁數(shù)： | 15/19頁 |
| 文件大小： | 0K |
| 描述： | TXRX ESD RS-485/422 5V 8-SOIC |
| 產(chǎn)品培訓(xùn)模塊： | Solutions for Industrial Control Applications |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 類型： | 收發(fā)器 |
| 驅(qū)動器/接收器數(shù)： | 1/1 |
| 規(guī)程： | RS422，RS485 |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SOICN |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱： | ISL83088EIBZ-TDKR |
5
FN6085.9
April 22, 2008
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V)
Input/Output Voltages
A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V
A, B, Y, Z (Transient Pulse Through 100
Ω, Note 14) . . . . . . ±75V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical, Note 3)
θ
JA (°C/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
105
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . .
140
10 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . .
190
14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
128
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
3.
θ
JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C
(Note 5).
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 4)
TYP
MAX
(Note 4)
UNITS
DC CHARACTERISTICS
Driver Differential VOUT (no load)
VOD1
Full
-
VCC
V
Driver Differential VOUT (with load)
VOD2
Full
2
2.9
-
V
Full
1.5
2.4
VCC
V
Full
1.5
2.6
-
V
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
ΔVOD
Full
-
0.01
0.2
V
Driver Common-Mode VOUT
VOC
Full
-
2.85
3
V
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
ΔVOC
Full
-
0.01
0.1
V
Logic Input High Voltage
VIH
DE, DI, RE
Full
2
-
V
Logic Input Low Voltage
VIL
DE, DI, RE
Full
-
0.8
V
DI Input Hysteresis Voltage
VHYS
25
-
100
-
mV
Logic Input Current
IIN1
DE, DI, RE
Full
-2
-
2
A
Input Current (A, B)
IIN2
DE = 0V, VCC = 0V or 5.5V VIN = 12V
Full
-
70
125
A
VIN = -7V
Full
-75
55
-
A
Output Leakage Current (Y, Z) (Full
Duplex Versions Only)
IIN3
RE = 0V, DE = 0V, VCC = 0V
or 5.5V (Note 13)
VIN = 12V
Full
-
7
125
A
VIN = -7V
Full
-75
11
-
A
Output Leakage Current (Y, Z)
in Shutdown Mode (Full Duplex)
IIN3
RE = VCC, DE = 0V,
VIN = 12V
Full
-
0
20
A
VIN = -7V
Full
-20
9
-
A
Driver Short-Circuit Current,
VO = High or Low
IOSD1
Full
-
±250
mA
ISL83080E, ISL83082E, ISL83083E, ISL83084E, ISL83085E, ISL83086E, ISL83088E
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