參數資料
型號: ISL81334IBZ
廠商: Intersil
文件頁數: 20/28頁
文件大?。?/td> 0K
描述: IC TXRX DUAL 2PORT ESD 28-SOIC
產品培訓模塊: Solutions for Industrial Control Applications
標準包裝: 520
類型: 收發(fā)器
驅動器/接收器數: 2/2
規(guī)程: RS232,RS422,RS485
電源電壓: 4.5 V ~ 5.5 V
安裝類型: 表面貼裝
封裝/外殼: 28-SOIC(0.295",7.50mm 寬)
供應商設備封裝: 28-SOIC W
包裝: 管件
27
FN6202.3
November 21, 2007
Small Outline Plastic Packages (SOIC)
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H
0.25(0.010)
B
M
M28.3 (JEDEC MS-013-AE ISSUE C)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.6969
0.7125
17.70
18.10
3
E
0.2914
0.2992
7.40
7.60
4
e
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.01
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N28
28
7
α
0o
8o
0o
8o
-
Rev. 0 12/93
ISL81334, ISL41334
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