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  • 參數(shù)資料
    型號(hào): ISL6610IRZ
    廠商: INTERSIL CORP
    元件分類: MOSFETs
    英文描述: Dual Synchronous Rectified MOSFET Drivers
    中文描述: 4 A BUF OR INV BASED MOSFET DRIVER, PQCC16
    封裝: 4 X 4 MM, ROHS COMPLIANT, PLASTIC, MO-220VGGC, QFN-16
    文件頁數(shù): 11/11頁
    文件大小: 279K
    代理商: ISL6610IRZ
    11
    All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
    Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
    Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
    notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
    reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
    from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
    For information regarding Intersil Corporation and its products, see www.intersil.com
    FN6395.0
    November 22, 2006
    ISL6610, ISL6610A
    Small Outline Plastic Packages (SOIC)
    NOTES:
    1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
    Publication Number 95.
    2. Dimensioning and tolerancing per ANSI Y14.5M
    -
    1982.
    3. Dimension “D” does not include mold flash, protrusions or gate burrs.
    Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
    inch) per side.
    4. Dimension “E” does not include interlead flash or protrusions. Interlead
    flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
    5. The chamfer on the body is optional. If it is not present, a visual index
    feature must be located within the crosshatched area.
    6. “L” is the length of terminal for soldering to a substrate.
    7. “N” is the number of terminal positions.
    8. Terminal numbers are shown for reference only.
    9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
    above the seating plane, shall not exceed a maximum value of
    0.61mm (0.024 inch).
    10. Controlling dimension: MILLIMETER. Converted inch dimensions
    are not necessarily exact.
    INDEX
    AREA
    E
    D
    N
    1
    2
    3
    -B-
    0.25(0.010)
    C A
    M
    B S
    e
    -A-
    L
    B
    M
    -C-
    A1
    A
    SEATING PLANE
    0.10(0.004)
    h x 45
    o
    C
    H
    0.25(0.010)
    B
    M
    M
    α
    M14.15
    (JEDEC MS-012-AB ISSUE C)
    14 LEAD NARROW BODY SMALL OUTLINE PLASTIC
    PACKAGE
    SYMBOL
    INCHES
    MILLIMETERS
    NOTES
    MIN
    MAX
    MIN
    MAX
    A
    0.0532
    0.0688
    1.35
    1.75
    -
    A1
    0.0040
    0.0098
    0.10
    0.25
    -
    B
    0.013
    0.020
    0.33
    0.51
    9
    C
    0.0075
    0.0098
    0.19
    0.25
    -
    D
    0.3367
    0.3444
    8.55
    8.75
    3
    E
    0.1497
    0.1574
    3.80
    4.00
    4
    e
    0.050 BSC
    1.27 BSC
    -
    H
    0.2284
    0.2440
    5.80
    6.20
    -
    h
    0.0099
    0.0196
    0.25
    0.50
    5
    L
    0.016
    0.050
    0.40
    1.27
    6
    N
    α
    14
    14
    7
    0
    o
    8
    o
    0
    o
    8
    o
    -
    Rev. 0 12/93
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