4
FN9091.5
January 4, 2005
Absolute Maximum Ratings
Recommended Operating Conditions
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltage (V
EN
, V
PWM
) . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V
BOOT Voltage (V
BOOT
). . . . . . . -0.3V to 22V (DC) or 33V (<200ns)
BOOT To PHASE Voltage (V
BOOT-PHASE
) . . . . . . . . . . .-0.3V to 7V
PHASE Voltage . . . . . . . . . . . . . .GND - 0.3V (DC) to 28V (<200ns)
. . . . . . . . . . GND - 5V (<100ns Pulse Width, 10
μ
J) to 28V (<200ns)
UGATE Voltage . . . . . . . . . . . V
PHASE
- 0.3V (DC) to
V
BOOT
+0.3V
. . . . . . . V
PHASE
- 4V (<200ns Pulse Width, 20
μ
J) to V
BOOT
+0.3V
LGATE Voltage. . . . . . . . . . . . . . . GND - 0.3V (DC) to V
VCC
+ 0.3V
. . . . . . . . . . . GND - 2V (<100ns Pulse Width, 4
μ
J) to V
VCC
+ 0.3V
Ambient Temperature Range. . . . . . . . . . . . . . . . . . .-40°C to 125°C
ESD Rating
HBM Class 1 JEDEC STD
Ambient Temperature Range. . . . . . . . . . . . . . . . . . . .-40°C to 85°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . . 125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V
±
10%
Thermal Information
Thermal Resistance (Notes 1, 2, & 3)
SOIC Package (Note 1) . . . . . . . . . . . .
QFN Package (Notes 2, 3). . . . . . . . . .
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150°C
Maximum Storage Temperature Range. . . . . . . . . . .-65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300°C
(SOIC - Lead Tips Only)
θ
JA
(°C/W)
110
95
θ
JC
(°C/W)
N/A
36
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2.
θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features.
3.
θ
JC
, "case temperature" location is at the center of the package underside exposed pad. See Tech Brief TB379 for details.
Electrical Specifications
These specifications apply for T
A
= -40
°
C to 85°C, unless otherwise noted
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
VCC SUPPLY CURRENT
Bias Supply Current
I
VCC
EN = LOW, T
A
= 0°C to 70°C
EN = LOW, T
A
= -40°C to 85°C
PWM pin floating, V
VCC
= 5V
-
-
-
-
-
1.5
2
-
μ
A
μ
A
μ
A
Bias Supply Current
PWM INPUT
Input Current
I
VCC
30
I
PWM
V
PWM
= 5V
V
PWM
= 0V
V
VCC
= 5V, T
A
= 0°C to 70°C
V
VCC
= 5V, T
A
= -40°C to 85°C
V
VCC
= 5V
V
VCC
= 5V, temperature = 25°C
-
-
-
-
250
-250
-
-
-
420
-
-
μ
A
μ
A
V
V
V
ns
PWM Three-State Rising Threshold
1.70
1.75
-
-
PWM Three-State Falling Threshold
Three-State Shutdown Holdoff Time
EN INPUT
EN LOW Threshold
EN HIGH Threshold
SWITCHING TIME
UGATE Rise Time
LGATE Rise Time
UGATE Fall Time
LGATE Fall Time
UGATE Turn-Off Propagation Delay
LGATE Turn-Off Propagation Delay
OUTPUT
Upper Drive Source Resistance
Upper Driver Source Current (Note 4)
Upper Drive Sink Resistance
Upper Driver Sink Current (Note 4)
Lower Drive Source Resistance
Lower Driver Source Current (Note 4)
Lower Drive Sink Resistance
Lower Driver Sink Current (Note 4)
NOTE:
4. Guaranteed by design. Not 100% tested in production.
3.3
-
1.0
-
-
-
-
V
V
2.0
t
RUGATE
t
RLGATE
t
FUGATE
t
FLGATE
t
PDLUGATE
t
PDLLGATE
V
VCC
= 5V, 3nF Load
V
VCC
= 5V, 3nF Load
V
VCC
= 5V, 3nF Load
V
VCC
= 5V, 3nF Load
V
VCC
= 5V, 3nF Load
V
VCC
= 5V, 3nF Load
-
-
-
-
-
-
8
8
8
4
8
8
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
R
UGATE
I
UGATE
R
UGATE
I
UGATE
R
LGATE
I
LGATE
R
LGATE
I
LGATE
500mA Source Current
V
UGATE-PHASE
= 2.5V
500mA Sink Current
V
UGATE-PHASE
= 2.5V
500mA Source Current
V
LGATE
= 2.5V
500mA Sink Current
V
LGATE
= 2.5V
-
-
-
-
-
-
-
-
1.0
2.0
1.0
2.0
1.0
2.0
0.4
4.0
2.5
-
2.5
-
2.5
-
1.0
-
A
A
A
A
ISL6605