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參數(shù)資料
| 型號： | ISL6253 |
| 廠商： | Intersil Corporation |
| 英文描述： | Highly Integrated Battery Charger for Notebook Computers |
| 中文描述： | 高度集成的電池充電器用于筆記本電腦 |
| 文件頁數(shù)： | 19/22頁 |
| 文件大小： | 549K |
| 代理商： | ISL6253 |
19
Figure 20 shows the type II compensator and its transfer
function is expressed as follows:
where
Compensator design goal:
High DC gain
Loop bandwidth f
c:
Gain margin: >10dB
Phase margin: 40°
The compensator design procedure is as follows:
1. Put compensator zero at
2. Put one compensator pole at zero frequency to achieve
high DC gain, and put another compensator pole at either
esr zero frequency or half switching frequency, whichever
is lower.
The loop gain T
v
(S) at cross over frequency of f
c
has unity
gain. Therefore, the compensator resistance R
1
is
determined by:
where g
m
is the trans-conductance of the voltage error
amplifier. Compensator capacitor C1 is then given by:
Example: V
in
= 20V, V
o
= 16.8V, I
o
= 4A, f
s
= 300kHz,
C
o
= 22
μ
F/10m
, L = 15
μ
H, g
m
= 250
μ
s, R
T
= 0.15
(R
cs
= 25m
, A
c
= 6), V
FB
= 2.1V, V
PWM
= V
IN
/11,
f
c
= 15kHz, then compensator resistance R
1
= 10k
.
Put the compensator zero at 1.7kHz, and put the
compensator pole at esr zero which is 725kHz. The
compensator capacitors are:
C
1
= 10nF, C
2
= 22pF
Such small C
2
may not be necessary since it does not affect
the phase and gain at such high frequency.
PCB Layout Considerations
Power and Signal Layer Placement on the PCB
As a general rule, power layers should be close together,
either on the top or bottom of the board, with signal layers on
the opposite side of the board. For example, layer
arrangement on a 4 layer board is shown below:
Layer 1: Small signal external components
Layer 2: Signal Ground
Layer 3: Power Ground
Layer 4: Bottom Layer: Power MOSFET, Inductors and
other Power traces
Separate the power voltage and current flowing path from
the control and logic level signal path. The controller IC will
stay on the signal layer, which is isolated by the signal
ground to the power signal traces.
Component Placement
The power MOSFET should be close to the IC so that the
gate drive signal, the LGATE, UGATE, PHASE, and BOOT
traces can be short.
Place the components in such a way that the area under the
IC has fewer noise traces with high dv/dt and di/dt, such as
gate signals and phase node signals.
SIGNAL GROUND AND POWER GROUND CONNECTION
At minimum, a reasonably large area of copper, which will
shield other noise couplings through the IC, should be used
as signal ground beneath the IC. The best tie-point between
the signal ground and the power ground is at the negative
side of the output capacitor on each side, where there is little
noise; a noisy trace beneath the IC is not recommended.
GND AND VDD PIN
At least one high quality ceramic decoupling cap should be
used to cross the GND and VDD pins. The decoupling cap
can be put close to the IC.
LGATE PIN
This is the gate drive signal for the bottom MOSFET of the
buck converter. The signal going through this trace has both
high dv/dt and high di/dt, and the peak charging and
discharging current is very high. These two traces should be
short, wide, and away from other traces. There should be no
other traces in parallel with these traces on any layer.
PGND PIN
The PGND pin should be laid out to the negative side of the
relevant output cap with separate traces. The negative side
of the output capacitor must be close to the source node of
the bottom MOSFET.
A
v
S
( )
v
v
FB
----
g
1
C
2
-------+
1
---------
+
S 1
cp
---------
+
-----------------------------
=
=
(EQ. 26)
ω
cz
1
1
--------------
ω
cp
C
1
1
2
C
2
+
----------------------
=
,
=
1
5
--
1
30
------
–
f
s
ω
cz
1
(
3
)
o
o
--------------
–
=
R
1
2
π
f
V
C
R
T
g
m
V
FB
-----------------------------------
=
(EQ. 27)
C
1
1
cz
-----------------
=
C
2
,
C
1
1
esr
1
–
------------------------------------------
=
(EQ. 28)
ISL6253
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISL6253HAZ | Highly Integrated Battery Charger for Notebook Computers |
| ISL6253HRZ | Highly Integrated Battery Charger for Notebook Computers |
| ISL6269A | High-Performance Notebook PWM Controller(高性能筆記本PWM控制器) |
| ISL6271ACRZ | Integrated XScale Regulator |
| ISL6271ACRZ-T | Integrated XScale Regulator |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISL6253EVAL1 | 功能描述:EVALUATION BOARD 1 ISL6253 RoHS:否 類別:編程器，開發(fā)系統(tǒng) >> 過時/停產(chǎn)零件編號 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 傳感器類型:CMOS 成像，彩色（RGB） 傳感范圍:WVGA 接口:I²C 靈敏度:60 fps 電源電壓:5.7 V ~ 6.3 V 嵌入式:否 已供物品:成像器板 已用 IC / 零件:KAC-00401 相關(guān)產(chǎn)品:4H2099-ND - SENSOR IMAGE WVGA COLOR 48-PQFP4H2094-ND - SENSOR IMAGE WVGA MONO 48-PQFP |
| ISL6253EVAL1Z | 功能描述:EVALUATION BOARD 1 ISL6253 RoHS:是 類別:編程器，開發(fā)系統(tǒng) >> 評估演示板和套件 系列:* 標(biāo)準(zhǔn)包裝:1 系列:PCI Express® (PCIe) 主要目的:接口，收發(fā)器，PCI Express 嵌入式:- 已用 IC / 零件:DS80PCI800 主要屬性:- 次要屬性:- 已供物品:板 |
| ISL6253HA | 制造商:Intersil Corporation 功能描述:NOTEBOOK BATTERY CHARGER, -10 TO +100, 28LD SSOP - Rail/Tube |
| ISL6253HA-T | 制造商:Intersil Corporation 功能描述:NOTEBOOK BATTERY CHARGER, -10 TO +100, 28LD SSOP, T&R - Tape and Reel |
| ISL6253HAZ | 功能描述:IC CTRLR BATTERY CHARGER 28QSOP RoHS:是 類別:集成電路 (IC) >> PMIC - 電池管理 系列:- 標(biāo)準(zhǔn)包裝:2,000 系列:Impedance Track™ 功能:燃料，電量檢測計/監(jiān)控器 電池化學(xué):鋰離子（Li-Ion） 電源電壓:2.4 V ~ 2.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:20-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:20-TSSOP 包裝:帶卷 (TR) 產(chǎn)品目錄頁面:1020 (CN2011-ZH PDF) 配用:BQ27350EVM-ND - BQ27350EVM 其它名稱:296-21665-2 |
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