參數(shù)資料
型號(hào): ISL59913IRZ-EVALZ
廠商: Intersil
文件頁(yè)數(shù): 3/12頁(yè)
文件大?。?/td> 0K
描述: EVAL BOARD FOR ISL59913IRZ
標(biāo)準(zhǔn)包裝: 1
系列: *
11
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FN6406.0
December 15, 2006
Where
Tj is the maximum junction temperature (+150°C)
Ta is the maximum ambient temperature (+85°C)
For a QFN 28 package in a properly layout PCB heatsinking
copper area, +37°C/W
θJA thermal resistance can be
achieved. To disperse the heat, the bottom heatspreader
must be soldered to the PCB. Heat flows through the
heatspreader to the circuit board copper then spreads and
converts to air. Thus the PCB copper plane becomes the
heatsink. This has proven to be a very effective technique. A
separate application note details the 28 Ld QFN. PCB
design considerations are available.
θ
JA
Tj
Ta
()
PD
-----------------------
=
50.4CW
=
(EQ. 3)
ISL59910, ISL59913
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