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參數(shù)資料
| 型號(hào)： | ISL5627EVAL1 |
| 廠(chǎng)商： | Intersil Corporation |
| 英文描述： | Dual 8-bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| 中文描述： | 雙8位，3.3伏，260 MSPS的，高速D / A轉(zhuǎn)換 |
| 文件頁(yè)數(shù)： | 12/12頁(yè) |
| 文件大?。?/td> | 468K |
| 代理商： | ISL5627EVAL1 |
12
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
ISL5627
Thin Plastic Quad Flatpack Packages (LQFP)
D
D1
E E1
-A-
PIN 1
A2 A1
A
11
o
-13
o
11
o
-13
o
0
o
-7
o
0.020
0.008MIN
0
o
MIN
L
PLANE
b
0.004/0.008
0.09/0.20
WITH PLATING
BASE METAL
SEATING
0.004/0.006
0.09/0.16
b1
-B-
e
0.003
0.08
A-B
S
D
S
C
M
0.08
0.003
-C-
-D-
-H-
0.25
0.010
GAGE
PLANE
Q48.7x7A
(JEDEC MS-026BBC ISSUE B)
48 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.062
-
1.60
-
A1
0.002
0.005
0.05
0.15
-
A2
0.054
0.057
1.35
1.45
-
b
0.007
0.010
0.17
0.27
6
b1
0.007
0.009
0.17
0.23
-
D
0.350
0.358
8.90
9.10
3
D1
0.272
0.280
6.90
7.10
4, 5
E
0.350
0.358
8.90
9.10
3
E1
0.272
0.280
6.90
7.10
4, 5
L
0.018
0.029
0.45
0.75
-
N
48
48
7
e
0.020 BSC
0.50 BSC
-
Rev. 2 1/99
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane
.
4. Dimensions D1 and E1 to be determined at datum plane
.
-H-
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm (0.003
inch).
7. “N” is the number of terminal positions.
-C-
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISL5627IN | Dual 8-bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5640 | Dual 8-Bit, A/D Converter with Internal Voltage Reference(雙路8位帶內(nèi)部電壓基準(zhǔn)的A/D轉(zhuǎn)換器) |
| ISL5757 | 10-bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5757EVAL1 | 10-bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5757IA | 10-bit, +3.3V, 260+MSPS, High Speed D/A Converter |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISL5627IN | 功能描述:IC DAC DUAL 8BIT 3.3V 48-LQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類(lèi)型:* 采樣率（每秒）:* |
| ISL5627INZ | 功能描述:IC DAC DUAL 8BIT 3.3V 48-LQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1,000 系列:- 設(shè)置時(shí)間:1µs 位數(shù):8 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:8 電壓電源:雙 ± 功率耗散（最大）:941mW 工作溫度:0°C ~ 70°C 安裝類(lèi)型:表面貼裝 封裝/外殼:24-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:24-SOIC W 包裝:帶卷 (TR) 輸出數(shù)目和類(lèi)型:8 電壓，單極 采樣率（每秒）:* |
| ISL5629 | 制造商:INTERSIL 制造商全稱(chēng):Intersil Corporation 功能描述:Dual 8-bit, +3.3V, 130/210MSPS, CommLink TM High Speed D/A Converter |
| ISL5629/2IN | 功能描述:IC DAC DUAL 8BIT 3.3V 48-LQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類(lèi)型:* 采樣率（每秒）:* |
| ISL5629/2INZ | 功能描述:IC DAC 8BIT CMOS DUAL 48LQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1,000 系列:- 設(shè)置時(shí)間:1µs 位數(shù):8 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:8 電壓電源:雙 ± 功率耗散（最大）:941mW 工作溫度:0°C ~ 70°C 安裝類(lèi)型:表面貼裝 封裝/外殼:24-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:24-SOIC W 包裝:帶卷 (TR) 輸出數(shù)目和類(lèi)型:8 電壓，單極 采樣率（每秒）:* |
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