
4
FN6229.0
March 17, 2006
Absolute Maximum Ratings
Thermal Information
V
CC
to V
EE
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 19V
V
EXT
to V
EE
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
Input Voltages
DATA, DRV EN, CVX, VH, VL, VINP, COMPX, LOSWING
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . (V
EE
-0.5V) to (V
CC
+0.5V)
Output Voltages
DOUT. . . . . . . . . . . . . . . . . . . . . . . . (V
EE
-0.5V) to (V
CC
+0.5V)
QX . . . . . . . . . . . . . (COMP LOW -0.5V) to (COMP HIGH +0.5V)
Thermal Resistance (Typical, Note 1)
72 Ld QFN Package. . . . . . . . . . . . . . .
Maximum Junction Temperature (Plastic Package) . . . . . . . 150°C
Maximum Storage Temperature Range. . . . . . . . . . .-65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
θ
JA
(°C/W)
23
θ
JC
(°C/W)
2.0
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θ
JA
is measured in free air with the component mounted on high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379 and Tech Brief TB389 for details. Device temperature is closely tied to data-rates, driver loads and overall pin activity. Review Power
Dissipation Considerations for more information.
Recommended Operating Conditions
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
Device Power-(V
EXT
= V
EE)
V
EXT
not used
V
CC
-V
EE
12 (Note 5)
15
18
V
Device Power-(V
EXT
= V
EE
+5.5V)
V
CC
-V
EE
9 (Note 5)
15
18
V
V
EXT
Optional External Logic Power
V
EXT
-V
EE
5.5 (Note 5)
5.75
6.0
V
Driver Output High Rail
V
H
V
EE
+1
-
V
CC
-0.5
V
Driver Output Low Rail
V
L
V
EE
+0.5
-
V
EE
+6
V
Comparator Output High Rail
COMP-High
V
EE
+1
-
V
CC
-0.5
V
Comparator Output Low Rail
COMP-Low
V
EE
+.5
-
V
EE
+6
V
Ambient Temperature
T
A
-40
-
+85
°C
Junction Temperature
T
J
-
-
+150
°C
Electrical Specifications
Test Conditions: V
CC
= 12V, V
EE
= -3V, VH = 6V, VL = 0V, Comp-High = 5V, Comp Low = 0V, V
EXT
= V
EE
and
LOSWING = V
CC,
25°C; Unless Otherwise specified.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
DRIVER DC CHARACTERISTICS
ISL55100B Output Resistance
R
OUTD
I
O
=
±
125mA, data not toggling
6
9
14
ISL55100B DC Output Current
Iout D
Per Individual driver
±125
-
-
mA
ISL55100B AC Output Current (Note 2)
IOUTDAC
Per Individual driver
-
600
-
mA
ISL55100A Minimum Output Swing
V
OMIN
V
H
= 200mV, V
L
= 0V
185
-
-
mV
Disabled HIZ Leakage Current
HIZ
V
OUT
= V
CC
with V
H
= V
L
+ V
EE
or
V
OUT
= VEE with V
H
= V
L
= V
CC
-1
0
1
μ
A
DRIVER TIMING CHARACTERISTICS
Data
±
to DOUT Propagation Delay
t
PD
Lowswing Disabled (Note 4)
5
12
16
ns
Lowswing Enabled (Note 4)
6
13
17
ns
Driver Timing Skew, All Edges (Note 2)
-
<1
-
ns
Disable (HIZ) Time
t
DIS
DVREN
±
Transition from Enable to
Disable
15
18
26
ns
Enable Time
t
EN
DVREN
±
Transition from Disable to
Enable: Lowswing Disabled (Note 4)
13
15
23
ns
DVREN
±
Transition from Disable to
Enable: Lowswing Enabled (Note 4)
13
18
23
ns
ISL55100B