參數(shù)資料
型號: ISL55020IRZ-T13
廠商: Intersil
文件頁數(shù): 9/11頁
文件大?。?/td> 0K
描述: IC AMP DIFF WIDEBAND 16-QFN
標準包裝: 2,500
放大器類型: 差分
電路數(shù): 1
輸出類型: 差分
轉(zhuǎn)換速率: 1200 V/µs
-3db帶寬: 300MHz
電流 - 輸入偏壓: 25µA
電壓 - 輸入偏移: 15000µV
電流 - 電源: 21mA
電流 - 輸出 / 通道: 150mA
電壓 - 電源,單路/雙路(±): 4.5 V ~ 12 V,±2.25 V ~ 6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-VQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 16-QFN-EP(4x4)
包裝: 帶卷 (TR)
7
FN6287.0
December 18, 2006
Pin Descriptions
PIN NUMBER
PIN NAME
EQUIVALENT
CIRCUIT
PIN FUNCTION
1, 6, 9, 12, 15
NC
No connect; grounded for best AC performance
2
FB+
Circuit1
Feedback from non-inverting output
3
IN+
Circuit 1
Non-inverting input
4
GND
Circuit 4
Ground
5
VCM
Circuit 1
Reference input, sets common-mode output voltage with AV = 1. Must be st to
V+/2 for single supply applications
7
V-
Circuit 4
Negative supply. Must be connected to GND for single supply operation
8EN
Circuit 2
Enable pin with internal pull-down; Logic “1” selects the disabled state; Logic “0”
selects the enabled state
10
IN-
Circuit 1
Inverting input
11
FB-
Circuit 1
Feedback from inverting output
13
OUT-
Circuit 3
Inverting output
14
V+
Circuit 4
Positive supply
16
OUT+
Circuit 3
Non-inverting output
Thermal Pad
Circuit 5
Pack thermal pad electrically connected to IC substrate - must be connected to
most negative voltage applied to the IC
IN+, IN-
V+
V-
EN
V+
V-
GND
V+
V-
OUT
CIRCUIT 3
CIRCUIT 1
CIRCUIT 2
FB+,FB-
VCM
V-
V+
CAPACITIVELY
COUPLED
ESD CLAMP
GND
CIRCUIT 4.
V-
THERMAL HEAT SINK PAD
~1M
Ω
SUBSTRATE
CIRCUIT 5
ISL55020
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