參數(shù)資料
型號(hào)： ISL5239KIZ
廠商： INTERSIL CORP
元件分類： 消費(fèi)家電
英文描述： Pre-Distortion Linearizer
中文描述： SPECIALTY CONSUMER CIRCUIT, PBGA196
封裝： 15 X 15 MM, ROHS COMPLIANT, PLASTIC, BGA-196
文件頁(yè)數(shù)： 31/31頁(yè)
文件大?。?/td> 653K
代理商： ISL5239KIZ
31
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How-
ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
www.intersil.com
ISL5239
Plastic Ball Grid Array Packages (BGA)
o
TOP VIEW
D
A1 CORNER
BOTTOM VIEW
P
N
L
M
J
K
G
H
F
E
8
13
14
121110 9
CORNER
7 6 5
3
4
2
C
D
A
B
1
SIDE VIEW
SEATING PLANE
C
A
A1
A2
bbb
C
aaa
A1 CORNER I.D.
E
A
B
E1
D1
b
S
ALL ROWS AND COLUMNS
S
M
A B
C
C
0.15
0.006
0.08
0.003
M
A1
A1
CORNER I.D.
e
A
A
C
V196.15x15
196 BALL PLASTIC BALL GRID ARRAY PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.059
-
1.50
-
A1
0.012
0.016
0.31
0.41
-
A2
0.037
0.044
0.93
1.11
-
b
0.016
0.020
0.41
0.51
7
D/E
0.587
0.595
14.90
15.10
-
D1/E1
0.508
0.516
12.90
13.10
-
N
196
196
-
e
0.039 BSC
1.0 BSC
-
MD/ME
14 x 14
14 x 14
3
bbb
0.004
0.10
-
aaa
0.005
0.12
-
Rev. 1 12/00
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D”
and “E” dimensions, respectively.
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the spher-
ical crowns of the contact balls.
6. Dimension “A” includes standoff height “A1”, package body
thickness and lid or cap height “A2”.
7. Dimension “b” is measured at the maximum ball diameter,
parallel to the primary datum C.
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
9. “S” is measured with respect to datum’s A and B and defines
the position of the solder balls nearest to package center-
lines. When there is an even number of balls in the outer row
the value is “S” = e/2.
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