參數(shù)資料
型號(hào): ISL5217KI
廠商: INTERSIL CORP
元件分類: 無繩電話/電話
英文描述: Quad Programmable Up Converter
中文描述: TELECOM, CELLULAR, BASEBAND CIRCUIT, PBGA196
封裝: 15 X 15 MM, PLASTIC, BGA-196
文件頁數(shù): 43/43頁
文件大?。?/td> 766K
代理商: ISL5217KI
43
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
ISL5217
Plastic Ball Grid Array Packages (BGA)
o
TOP VIEW
D
A1 CORNER
BOTTOM VIEW
P
N
L
M
J
K
G
H
F
E
8
13
14
121110 9
CORNER
7 6 5
3
4
2
C
D
A
B
1
SIDE VIEW
SEATING PLANE
C
A
A1
A2
bbb
C
aaa
A1 CORNER I.D.
E
A
B
E1
D1
b
S
ALL ROWS AND COLUMNS
S
M
A B
C
C
0.15
0.006
0.08
0.003
M
A1
A1
CORNER I.D.
e
A
A
C
V196.15x15
196 BALL PLASTIC BALL GRID ARRAY PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.059
-
1.50
-
A1
0.012
0.016
0.31
0.41
-
A2
0.037
0.044
0.93
1.11
-
b
0.016
0.020
0.41
0.51
7
D/E
0.587
0.595
14.90
15.10
-
D1/E1
0.508
0.516
12.90
13.10
-
N
196
196
-
e
0.039 BSC
1.0 BSC
-
MD/ME
14 x 14
14 x 14
3
bbb
0.004
0.10
-
aaa
0.005
0.12
-
Rev. 1 12/00
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D”
and “E” dimensions, respectively.
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the spher-
ical crowns of the contact balls.
6. Dimension “A” includes standoff height “A1”, package body
thickness and lid or cap height “A2”.
7. Dimension “b” is measured at the maximum ball diameter,
parallel to the primary datum C.
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
9. “S” is measured with respect to datum’s A and B and defines
the position of the solder balls nearest to package center-
lines. When there is an even number of balls in the outer row
the value is “S” = e/2.
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