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參數(shù)資料
| 型號(hào)： | ISL4485EIB |
| 廠商： | Intersil |
| 文件頁(yè)數(shù)： | 10/11頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC TXRX RS-485/422 5V ESD 8-SOIC |
| 標(biāo)準(zhǔn)包裝： | 98 |
| 類型： | 收發(fā)器 |
| 驅(qū)動(dòng)器/接收器數(shù)： | 1/1 |
| 規(guī)程： | RS422，RS485 |
| 電源電壓： | 4.5 V ~ 5.5 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SOICN |
| 包裝： | 管件 |
| 產(chǎn)品目錄頁(yè)面： | 1241 (CN2011-ZH PDF) |
8
temperature drops about 15 degrees. If the contention
persists, the thermal shutdown / reenable cycle repeats until
the fault is cleared. Receivers stay operational during
thermal shutdown.
ESD Protection
All pins on these interface devices include class 3 Human
Body Model (HBM) ESD protection structures, but the
RS-485 pins (driver outputs and receiver inputs) incorporate
advanced structures allowing them to survive ESD events in
excess of
±15kV HBM. The RS-485 pins are particularly
vulnerable to ESD damage because they typically connect to
an exposed port on the exterior of the finished product.
Simply touching the port pins, or connecting a cable, can
cause an ESD event that might destroy unprotected ICs.
These new ESD structures protect the device whether or not
it is powered up, protect without allowing any latchup
mechanism to activate, and without degrading the RS-485
common mode range of -7V to +12V. This built-in ESD
protection eliminates the need for board level protection
structures (e.g., transient suppression diodes), and the
associated, undesirable capacitive load they present.
Human Body Model Testing
As the name implies, this test method emulates the ESD
event delivered to an IC during human handling. The tester
delivers the charge stored on a 100pF capacitor through a
1.5k
current limiting resistor into the pin under test. The
HBM method determines an ICs ability to withstand the ESD
events typically present during handling and manufacturing.
The RS-485 pin survivability on this high ESD device has
been characterized to be in excess of
±15kV, for discharges
to GND.
Typical Performance Curves VCC = 5V, TA = 25oC; Unless Otherwise Specified
FIGURE 7. DRIVER AND RECEIVER WAVEFORMS DRIVING
300 FEET OF CABLE (DOUBLE TERMINATED)
FIGURE 8. DRIVER AND RECEIVER WAVEFORMS DRIVING
450 FEET OF CABLE (DOUBLE TERMINATED)
FIGURE 9. DATA RATE vs DIFFERENTIAL CAPACITANCE
FIGURE 10. SUPPLY CURRENT vs TEMPERATURE
TIME (20ns/DIV)
-3
RE
CE
IV
ER
OU
TPU
T
(V
)
1.5
3
-1.5
0
A - B
0
5
RECEIVER
IN
P
U
T
(V
)
0
5
DRIVER
IN
P
U
T
(V
)
DI
RO
DRIVER+CABLE DELAY
(~450ns)
TIME (20ns/DIV)
-3
RE
CE
IV
ER
OU
TPU
T
(V
)
1.5
3
-1.5
0
A - B
0
5
RECEIVER
IN
P
U
T
(V
)
0
5
DRIVER
IN
P
U
T
(V
)
DI
RO
DRIVER+CABLE DELAY
(~650ns)
DIFFERENTIAL CAPACITANCE (pF)
DATA
RATE
(Mbps)
500 1000 2000 3000 4000 5000 6000 7000 8000 9000 10000
0
5
10
15
20
25
30
RDIFF = 54
-40
0
50
85
TEMPERATURE (oC)
I CC
(
A)
-25
25
75
400
450
500
550
600
650
700
750
DE = VCC, RE = X
DE = GND, RE = X
ISL4485E
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