參數資料
| 型號： | ISL32374EFBZ |
| 廠商： | Intersil |
| 文件頁數： | 13/20頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC XMITTER ESD RS422 LP 16-SOIC |
| 標準包裝： | 48 |
| 類型： | 發(fā)射器 |
| 驅動器/接收器數： | 4/0 |
| 規(guī)程： | RS422 |
| 電源電壓： | 3 V ~ 5.5 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-SOIC（0.154"，3.90mm 寬） |
| 供應商設備封裝： | 16-SOIC |
| 包裝： | 管件 |
20
FN6824.1
March 13, 2013
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
For additional products, see www.intersil.com/en/products.html
ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E
Thin Shrink Small Outline Package Family (TSSOP)
N
(N/2)+1
(N/2)
TOP VIEW
A
D
0.20 C
2X
B A
N/2 LEAD TIPS
B
E1
E
0.25
CAB
M
1
H
PIN #1 I.D.
0.05
e
C
0.10 C
N LEADS
SIDE VIEW
0.10
CAB
M
b
c
SEE DETAIL “X”
END VIEW
DETAIL X
A2
0° - 8°
GAUGE
PLANE
0.25
L
A1
A
L1
SEATING
PLANE
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
SYMBOL
MILLIMETERS
TOLERANCE
14 LD 16 LD 20 LD 24 LD 28 LD
A
1.20
Max
A1
0.10
±0.05
A2
0.90
±0.05
b
0.25
+0.05/-0.06
c
0.15
+0.05/-0.06
D
5.00
6.50
7.80
9.70
±0.10
E
6.40
Basic
E1
4.40
±0.10
e
0.65
Basic
L
0.60
±0.15
L1
1.00
Reference
Rev. F 2/07
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M
-1994.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| ISL32374EFBZ-T | 功能描述:IC XMITTER ESD RS422 LP 16-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 驅動器，接收器，收發(fā)器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:- 類型:發(fā)射器 驅動器/接收器數:4/0 規(guī)程:RS422，RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:16-SOIC 包裝:帶卷 (TR) |
| ISL32374EFVZ | 功能描述:IC XMITTER ESD RS422 LP 16-TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 驅動器，接收器，收發(fā)器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:- 類型:發(fā)射器 驅動器/接收器數:4/0 規(guī)程:RS422，RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:16-SOIC 包裝:帶卷 (TR) |
| ISL32374EFVZ-T | 功能描述:IC XMITTER ESD RS422 LP 16-TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 驅動器，接收器，收發(fā)器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:- 類型:發(fā)射器 驅動器/接收器數:4/0 規(guī)程:RS422，RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:16-SOIC 包裝:帶卷 (TR) |
| ISL32374EIBZ | 功能描述:IC XMITTER ESD RS422 LP 16-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 驅動器，接收器，收發(fā)器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:- 類型:發(fā)射器 驅動器/接收器數:4/0 規(guī)程:RS422，RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:16-SOIC 包裝:帶卷 (TR) |
| ISL32374EIBZ-T | 功能描述:IC XMITTER ESD RS422 LP 16-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 驅動器，接收器，收發(fā)器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:2,500 系列:- 類型:發(fā)射器 驅動器/接收器數:4/0 規(guī)程:RS422，RS485 電源電壓:4.75 V ~ 5.25 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:16-SOIC 包裝:帶卷 (TR) |
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