5 FN7639.0 June 17, 2010 Absolute Maximum Ratings Thermal Information V
參數(shù)資料
型號(hào)： ISL31478EIBZ-T
廠商： Intersil
文件頁(yè)數(shù)： 17/21頁(yè)
文件大?。?/td> 0K
描述： IC TXRX RS485 FAULT PROT 8SOIC
標(biāo)準(zhǔn)包裝： 2,500
類型： 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù)： 1/1
規(guī)程： RS422，RS485
電源電壓： 4.5 V ~ 5.5 V
安裝類型： 表面貼裝
封裝/外殼： 8-SOIC（0.154"，3.90mm 寬）
供應(yīng)商設(shè)備封裝： 8-SOICN
包裝： 帶卷 (TR)
ISL31470E, ISL31472E, ISL31475E, ISL31478E
5
FN7639.0
June 17, 2010
Absolute Maximum Ratings
Thermal Information
VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V)
Input/Output Voltages
A/Y, B/Z, A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . ±60V
A/Y, B/Z, A, B, Y, Z
(Transient Pulse Through 100Ω, Note 17) . . . . . . . ±80V
RO . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite
ESD Rating . . . . . . . . . . . . . . . . . . see Specification Table
Latch-up (per JESD78, Level 2, Class A) . . . . . . . . . +125°C
Recommended Operating Conditions
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . 5V
Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C
Bus Pin Common Mode Voltage Range . . . . . . -15V to +15V
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
8 Ld PDIP* Package (Notes 5, 7) . . .
105
60
8 Ld SOIC Package (Notes 6, 7). . . .
116
47
14 Ld SOIC Package (Notes 6, 7). . .
88
39
Maximum Junction Temperature (Plastic Package) . . . .+150°C
Maximum Storage Temperature Range . . . . -65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . .see link below
*Pb-free PDIPs can be used for through-hole wave solder
processing only. They are not intended for use in Reflow
solder processing applications.
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
5. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air.
6. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
7. For θJC, the “case temp” location is taken at the package top center.
Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V,
TA = +25°C (Note 8). Boldface limits apply over the operating temperature range,
-40°C to +85°C.
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 16) TYP
MAX
(Note 16) UNITS
DC CHARACTERISTICS
Driver Differential VOUT
(No load)
VOD1
Full
-
VCC
V
Driver Differential VOUT
(Loaded, Figure 1A)
VOD2
RL = 100Ω (RS-422)
Full
2.4
3.2
-
V
RL = 54Ω (RS-485)
Full
1.5
2.5
VCC
V
RL = 54Ω (PROFIBUS, VCC ≥ 5V)
Full
2.0
2.5
-
RL = 21Ω (Six 120Ω terminations for
Star Configurations, VCC ≥ 4.75V)
Full
0.8
1.3
-
V
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
ΔVOD
RL = 54Ω or 100Ω (Figure 1A)
Full
-
0.2
V
Driver Differential VOUT with
Common Mode Load
(Figure 1B)
VOD3
RL = 60Ω, -7V ≤ VCM ≤ 12V
Full
1.5
2.1
VCC
V
RL = 60Ω, -15V ≤ VCM ≤ 15V
(VCC ≥ 4.75V)
Full
1.7
2.3
-
v
Driver Common-Mode VOUT
(Figure 1A)
VOC
RL = 54Ω or 100Ω
Full
-1
-
3
V
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
ΔVOC
RL = 54Ω or 100Ω (Figure 1A)
Full
-
0.2
V
Driver Short-Circuit Current
IOSD
DE = VCC, -15V ≤ VO ≤ 15V (Note 10) Full
-250
-
250
mA
IOSD1
At First Fold-back, 22V ≤ VO ≤ -22V
Full
-83
-
83
mA
IOSD2
At Second Fold-back, 35V ≤ VO ≤ -35V Full
-13
-
13
mA
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