34 November 30, 2012 FN6632.10 Package Outline Drawing (M14.173) M1" />
參數(shù)資料
型號(hào): ISL28117SOICEVAL1Z
廠商: Intersil
文件頁(yè)數(shù): 28/34頁(yè)
文件大?。?/td> 0K
描述: EVAL BOARD FOR ISL28117 SOIC
產(chǎn)品培訓(xùn)模塊: Solutions for Industrial Control Applications
標(biāo)準(zhǔn)包裝: 1
每 IC 通道數(shù): 1 - 單
放大器類型: 通用
輸出類型: 單端
轉(zhuǎn)換速率: 0.5 V/µs
電流 - 輸出 / 通道: 43mA
工作溫度: -40°C ~ 125°C
電流供應(yīng)(主 IC): 440µA
電壓 - 電源,單路/雙路(±): 4.5 V ~ 40 V,±2.25 V ~ 20 V
板類型: 完全填充
已供物品:
已用 IC / 零件: ISL28117
ISL28117, ISL28217, ISL28417
34
November 30, 2012
FN6632.10
Package Outline Drawing (M14.173)
M14.173
14 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 3, 10/09
DETAIL "X"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
B
A
17
8
14
C
PLANE
SEATING
0.10 C
0.10
CBA
H
PIN #1
I.D. MARK
5.00 ±0.10
4.40 ±0.10
0.25 +0.05/-0.06
6.40
0.20 C B A
0.05
0°-8°
GAUGE
PLANE
SEE
0.90 +0.15/-0.10
0.60 ±0.15
0.09-0.20
5
2
3
1
3
1.00 REF
0.65
1.20 MAX
0.25
0.05 MIN
0.15 MAX
(1.45)
(5.65)
(0.65 TYP)
(0.35 TYP)
DETAIL "X"
1. Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.80mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead is 0.07mm.
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153, variation AB-1.
NOTES:
END VIEW
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