19 FN7874.0 June 21, 2011 Thin Shrink Small Outline Package Family (TSSOP) N (N/2)+1 (N/2) TOP VIEW A D 0.20 C 2X B A N/2 LEAD TIPS B " />
參數(shù)資料
型號(hào): ISL23445TFVZ-TK
廠商: Intersil
文件頁(yè)數(shù): 11/20頁(yè)
文件大小: 0K
描述: IC DGTL POT 256POS 100K 20TSSOP
產(chǎn)品培訓(xùn)模塊: Solutions for Industrial Control Applications
標(biāo)準(zhǔn)包裝: 1,000
系列: XDCP™
接片: 256
電阻(歐姆): 100k
電路數(shù): 4
溫度系數(shù): 標(biāo)準(zhǔn)值 45 ppm/°C
存儲(chǔ)器類型: 易失
接口: 4 線 SPI(芯片選擇)
電源電壓: 1.2 V ~ 5.5 V,1.7 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: *
封裝/外殼: *
供應(yīng)商設(shè)備封裝: *
包裝: *
ISL23445
19
FN7874.0
June 21, 2011
Thin Shrink Small Outline Package Family (TSSOP)
N
(N/2)+1
(N/2)
TOP VIEW
A
D
0.20 C
2X
B A
N/2 LEAD TIPS
B
E1
E
0.25
CAB
M
1
H
PIN #1 I.D.
0.05
e
C
0.10 C
N LEADS
SIDE VIEW
0.10
CAB
M
b
c
SEE DETAIL “X”
END VIEW
DETAIL X
A2
0° - 8°
GAUGE
PLANE
0.25
L
A1
A
L1
SEATING
PLANE
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
SYMBOL
MILLIMETERS
TOLERANCE
14 LD 16 LD 20 LD 24 LD 28 LD
A
1.20
Max
A1
0.10
±0.05
A2
0.90
±0.05
b
0.25
+0.05/-0.06
c
0.15
+0.05/-0.06
D
5.00
6.50
7.80
9.70
±0.10
E
6.40
Basic
E1
4.40
±0.10
e
0.65
Basic
L
0.60
±0.15
L1
1.00
Reference
Rev. F 2/07
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M
-1994.
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