20 FN7778.1 August 15, 2011 Package Outline Drawing L10.2.1x1.6A 10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 5, 3/10 BOTT" />
參數資料
型號: ISL23315TFUZ-TK
廠商: Intersil
文件頁數: 13/20頁
文件大?。?/td> 0K
描述: IC DGTL POT 256POS 100K 10MSOP
產品培訓模塊: Solutions for Industrial Control Applications
標準包裝: 1,000
系列: XDCP™
接片: 256
電阻(歐姆): 100k
電路數: 1
溫度系數: 標準值 70 ppm/°C
存儲器類型: 易失
接口: I²C(設備位址)
電源電壓: 1.2 V ~ 5.5 V,1.7 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 10-TFSOP,10-MSOP(0.118",3.00mm 寬)
供應商設備封裝: 10-MSOP
包裝: 帶卷 (TR)
ISL23315
20
FN7778.1
August 15, 2011
Package Outline Drawing
L10.2.1x1.6A
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 5, 3/10
BOTTOM VIEW
DETAIL "X"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VIEW
1
2X
0.10
1.6
0
2.10
B
A
INDEX AREA
PIN 1
1
(6X 0.50 )
(10 X 0.20)
(0.10 MIN.)
(0.05 MIN)
8.
(10X 0.60)
PACKAGE
(2.00)
(0.80)
(1.30)
(2.50)
0.08
SEATING PLANE
0.10 C
C
SEE DETAIL "X"
MAX. 0.55
0 . 125 REF
0-0.05
C
6
9
1
5
6X 0.50
C
10 X 0.20 4
0.10
M
MA B
0.80
PIN #1 ID
4
10
0.10 MIN.
0.05 MIN.
4X 0.20 MIN.
8.
10X 0.40
OUTLINE
Lead width dimension applies to the metallized terminal and is measured
The configuration of the pin #1 identifier is optional, but must be located within
the zone indicated. The pin #1 identifier may be either a mold or mark feature.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
Unless otherwise specified, tolerance : Decimal ± 0.05
1.
All Dimensions are in millimeters. Angles are in degrees.
Dimensions in (
) for Reference Only.
between 0.15mm and 0.30mm from the terminal tip.
Maximum package warpage is 0.05mm.
4.
5.
2.
3.
NOTES:
Maximum allowable burrs is 0.076mm in all directions.
6.
Same as JEDEC MO-255UABD except:
7.
No lead-pull-back, MIN. Package thickness = 0.45 not 0.50mm
Lead Length dim. = 0.45mm max. not 0.42mm.
8.
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