參數(shù)資料
型號: ISL22426
廠商: Intersil Corporation
英文描述: Low Noise, Low Power, SPI Bus, 128 Taps(低噪聲,低功率,SPI總線, 128抽頭電位器)
中文描述: 低噪聲,低功耗,SPI總線,128絲錐(低噪聲,低功率和SPI總線,128抽頭電位器)
文件頁數(shù): 3/13頁
文件大小: 468K
代理商: ISL22426
3
FN6180.0
July 17, 2006
Analog Specifications
Absolute Maximum Ratings
Thermal Information
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage at any Digital Interface Pin
with Respect to GND . . . . . . . . . . . . . . . . . . . . . -0.3V to V
CC
+0.3
V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to +6V
Voltage at any DCP pin with Respect to GND. . . . . . . -0.3V to V
CC
Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . .300°C
I
W
(10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA
Latchup (Note 4) . . . . . . . . . . . . . . . . . . Class II, Level B @ +125°C
ESD (HBM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5kV
(CDM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1kV
Thermal Resistance (Typical, Note 3)
14 Lead TSSOP. . . . . . . . . . . . . . . . . . . . . . . . . . . .
θ
JA
(°C/W)
100
Recommended Operating Conditions
Temperature Range (Extended Industrial). . . . . . . .-40°C to +125°C
Power Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5mW
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . .+150°C
V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
Wiper Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±3.0mA
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3.
θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
4. Jedec Class II pulse conditions and failure criterion used. Level B exceptions are: using a max positive pulse of 6.5V on the SHDN pin, and using
a max negative pulse of -0.8V for all pins.
Over recommended operating conditions unless otherwise stated.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
(NOTE 5)
MAX
UNIT
R
TOTAL
R
H
to R
L
resistance
W option
10
k
U option
50
k
R
H
to R
L
resistance tolerance
W and U option
-20
+20
%
End-to-End Temperature Coefficient
W option
±50
ppm/°C
(Note 21)
U option
±80
ppm/°C
(Note 21)
V
RH
, V
RL
V
RH
and V
RL
Terminal Voltages
V
RH
and V
RL
to GND
0
V
CC
V
R
W
Wiper resistance
V
CC
= 3.3V @ +25°C, wiper current =
V
CC
/R
TOTAL
70
200
C
H
/C
L
/C
W
(Note 21)
Potentiometer capacitance
10/10/25
pF
I
LkgDCP
Leakage on DCP pins
Voltage at pin from GND to V
CC
0.1
1
μA
VOLTAGE DIVIDER MODE
(0V @ R
L
i; V
CC
@ R
H
i; measured at R
W
i, unloaded; i = 0 or 1)
INL
(Note 10)
Integral non-linearity
Monotonic over all tap positions
-1
1
LSB
(Note 6)
DNL
(Note 9)
Differential non-linearity
Monotonic over all tap positions
-0.5
0.5
LSB
(Note 6)
ZSerror
(Note 7)
Zero-scale error
W option
0
1
5
LSB
(Note 6)
U option
0
0.5
2
FSerror
(Note 8)
Full-scale error
W option
-5
-1
0
LSB
(Note 6)
U option
-2
-1
0
V
MATCH
(Note 11)
DCP to DCP matching
Any two DCPs at same tap position, same
voltage at all R
H
terminals, and same voltage
at all R
L
terminals
-2
2
LSB
(Note 6)
TC
V
(Note 12)
Ratiometric temperature coefficient
DCP register set to 40 hex
±4
ppm/°C
ISL22426
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