參數(shù)資料
型號(hào): ISL22316UFU10Z-TK
廠商: Intersil
文件頁(yè)數(shù): 6/15頁(yè)
文件大?。?/td> 0K
描述: IC POT DGTL 128TP LN LP 10-MSOP
產(chǎn)品培訓(xùn)模塊: Solutions for Industrial Control Applications
標(biāo)準(zhǔn)包裝: 1,000
系列: XDCP™
接片: 128
電阻(歐姆): 50k
電路數(shù): 1
溫度系數(shù): 標(biāo)準(zhǔn)值 ±80 ppm/°C
存儲(chǔ)器類型: 非易失
接口: I²C(設(shè)備位址)
電源電壓: 2.7 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 10-TFSOP,10-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 10-MSOP
包裝: 帶卷 (TR)
14
FN6186.2
September 1, 2009
ISL22316
Thin Dual Flat No-Lead Plastic Package (TDFN)
//
NX (b)
SECTION "C-C"
FOR ODD TERMINAL/SIDE
e
CC
5
CL
TERMINAL TIP
(A1)
BOTTOM VIEW
A
6
AREA
INDEX
C
0.10
0.08
SIDE VIEW
0.15
2X
E
A
B
C
0.15
D
TOP VIEW
CB
2X
6
8
AREA
INDEX
NX L
E2
E2/2
REF.
e
N
(Nd-1)Xe
(DATUM A)
(DATUM B)
5
0.10
8
7
D2
B
A
C
N-1
12
PLANE
SEATING
C
A
A3
NX b
D2/2
NX k
9 L
M
L10.3x3B
10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.70
0.75
0.80
-
A1
-
0.05
-
A3
0.20 REF
-
b
0.18
0.25
0.30
5, 8
D
3.00 BSC
-
D2
2.23
2.38
2.48
7, 8
E
3.00 BSC
-
E2
1.49
1.64
1.74
7, 8
e
0.50 BSC
-
k
0.20
-
L
0.30
0.40
0.50
8
N10
2
Nd
5
3
Rev. 0 2/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd refers to the number of terminals on D.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
9. COMPLIANT TO JEDEC MO-229-WEED-3 except for
dimensions E2 & D2.
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