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| 型號(hào)： | ISL12020MIRZ-EVALZ |
| 廠商： | Intersil |
| 文件頁數(shù)： | 33/34頁 |
| 文件大?。?/td> | 0K |
| 描述： | EVAL BOARD FOR ISL12020MIRZ |
| 產(chǎn)品培訓(xùn)模塊： | Solutions for Industrial Control Applications |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 主要目的： | 計(jì)時(shí)，實(shí)時(shí)時(shí)鐘（RTC） |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ISL12020M |
| 主要屬性： | 128 B SRAM，可編程夏令時(shí) |
| 次要屬性： | I²C 接口 |
| 已供物品： | 板 |
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ISL12020M
8
FN6667.5
December 13, 2011
tHD:STA
START Condition Hold Time
From SDA falling edge
crossing 30% of VDD to SCL
falling edge crossing 70% of
VDD.
600
ns
tSU:DAT
Input Data Setup Time
From SDA exiting the 30% to
70% of VDD window, to SCL
rising edge crossing 30% of
VDD.
100
ns
tHD:DAT
Input Data Hold Time
From SCL falling edge
crossing 30% of VDD to SDA
entering the 30% to 70% of
VDD window.
20
900
ns
tSU:STO
STOP Condition Setup Time
From SCL rising edge
crossing 70% of VDD, to SDA
rising edge crossing 30% of
VDD.
600
ns
tHD:STO
STOP Condition Hold Time
From SDA rising edge to SCL
falling edge. Both crossing
70% of VDD.
600
ns
tDH
Output Data Hold Time
From SCL falling edge
crossing 30% of VDD, until
SDA enters the 30% to 70%
of VDD window.
0
ns
tR
SDA and SCL Rise Time
From 30% to 70% of VDD.
20 + 0.1 x Cb
300
ns
tF
SDA and SCL Fall Time
From 70% to 30% of VDD.
20 + 0.1 x Cb
300
ns
Cb
Capacitive Loading of SDA or SCL Total on-chip and off-chip
10
400
pF
RPU
SDA and SCL Bus Pull-up Resistor
Off-chip
Maximum is determined by
tR and tF.
For Cb = 400pF, max is
about 2k
~2.5k.
For Cb = 40pF, max is about
15k
~20k
1
k
NOTES:
8. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested.
9. Specified at +25°C.
10. Minimum VDD and/or VBAT of 1V to sustain the SRAM. The value is based on characterization and it is not tested.
11. Temperature Conversion is inactive below VBAT = 2.7V. Device operation is not guaranteed at VBAT<1.8V.
12. IRQ/FOUT Inactive.
13. VDD > VBAT +VBATHYS
14. In order to ensure proper timekeeping, the VDD SR- specification must be followed.
15. Limits should be considered typical and are not production tested.
16. These are I2C specific parameters and are not tested, however, they are used to set conditions for testing devices to validate
specification.
17. To avoid EEPROM recall issues, it is advised to use this minimum power up slew rate. Not tested, shown as typical only.
I2C Interface Specifications Test Conditions: VDD = +2.7 to +5.5V, Temperature = -40°C to +85°C, unless otherwise specified.
Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued)
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
(Note 8)
TYP (Note 9)
MAX
(Note 8)
UNITS
NOTES
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| ISL12020MIRZ-T | 功能描述:實(shí)時(shí)時(shí)鐘 LDAL TIME CLK & TEMP COMPENSATED CR RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| ISL12020MIRZ-T7A | 功能描述:實(shí)時(shí)時(shí)鐘 LDAL TIME CLK & TEMP COMPENSATED CR RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| ISL12021 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Real Time Clock with On Chip Temp Compensation 【5ppm |
| ISL12021CVZ | 功能描述:IC RTC LP BATT BACK SRAM 14TSSOP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 實(shí)時(shí)時(shí)鐘 系列:- 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 類型:時(shí)鐘/日歷 特點(diǎn):警報(bào)器，閏年，SRAM 存儲(chǔ)容量:- 時(shí)間格式:HH:MM:SS（12/24 小時(shí)） 數(shù)據(jù)格式:YY-MM-DD-dd 接口:SPI 電源電壓:2 V ~ 5.5 V 電壓 - 電源，電池:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-WDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-TDFN EP 包裝:管件 |
| ISL12021IVZ | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Real Time Clock with On Chip Temp Compensation 【5ppm |
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