Publication Release Date: Oct 31 2008 - 4 - Revision 1.2 2 FEATURES Fully-Integrated Solution Single-chip voice record/p" />
參數(shù)資料
型號: ISD5008SYI
廠商: Nuvoton Technology Corporation of America
文件頁數(shù): 34/54頁
文件大?。?/td> 0K
描述: IC VOICE REC/PLAY 4-8MIN 28-SOIC
標準包裝: 25
系列: ISD5008
接口: SPI/Microwire
濾波器通頻帶: 1.7 ~ 3.4kHz
持續(xù)時間: 4-8 分鐘
安裝類型: 表面貼裝
封裝/外殼: 28-SOIC(0.295",7.50mm 寬)
供應商設備封裝: 28-SOIC
配用: ISD-ES511-ND - EVALUATION SYSTEM FOR ISD5100
ISD-ES501-ND - EVALUATION SYSTEM FOR ISD5008
ISD5008
Publication Release Date: Oct 31 2008
- 4 -
Revision 1.2
2
FEATURES
Fully-Integrated Solution
Single-chip voice record/playback solution
Integrated sampling clock, anti-aliasing and smoothing filters, and MLS array
Integrated analog features such as automatic gain control (AGC), audio gating switches, speaker
driver, summing amplifiers, volume control, and AUX IN/AUX OUT interface (e.g., for car kits)
Low-Power Consumption
Single +3 volt supply
Operating current:
o
ICC_Play = 15 mA (typical)
o
ICC_Rec = 25 mA (typical)
o
ICC_Feedthru = 12 mA (typical)
Standby current:
o
ISB = 1 A (typical)
Power consumption controlled by SPI or Microwire control register
Most stages can be individually powered down for minimum power consumption
Enhanced Voice Features
One or two-way (full duplex) conversation record (record signal summation)
One- or two-way (full duplex) message playback (while on a call)
Voice memo record and playback
Private call screening
Answering machine
Personalized outgoing message (given caller ID information from host chip set)
Private call announce while on call (given CIDCW information from host chip set)
Easy-to-Use and Control
No compression algorithm development required
User-selectable sampling rates of 8.0 kHz, 6.4 kHz, 5.3 kHz, or 4.0 kHz
Microcontroller SPI or Microwire Serial Interface
Fully addressable to handle multiple messages
High Quality Solution
High quality voice and music reproduction
Standard 100-year message retention (typical)
100,000 record cycles (typical)
Options
Available in die, PDIP, SOIC, TSOP, and chip scale packaging (CSP)
Compact BGA chip scale package available for portable applications
Temperature : Commercial, Extended and Industrial
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