參數(shù)資料
型號(hào)： ISD2532E
廠商： WINBOND ELECTRONICS CORP
元件分類： 音頻合成
英文描述： SINGLE-CHIP, MULTIPLE-MESSAGES, VOICE RECORD/PLAYBACK DEVICE 32-, 40-, 48-, AND 64-SECOND DURATION
中文描述： 32 SEC, SPEECH SYNTHESIZER WITH RCDG, PDSO28
封裝： 8 X 13.40 MM, PLASTIC, TSOP1-28
文件頁數(shù)： 4/42頁
文件大?。?/td> 1356K
代理商： ISD2532E
ISD2532/40/48/64
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 2
3. BLOCK DIAGRAM .............................................................................................................................. 3
4. TABLE OF CONTENTS...................................................................................................................... 4
5. PIN CONFIGURATION....................................................................................................................... 5
6. PIN DESCRIPTION............................................................................................................................. 6
7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10
7.1. Detailed Description.................................................................................................................... 10
7.2. Operational Modes ..................................................................................................................... 11
7.2.1. Operational Modes Description............................................................................................ 12
8. TIMING DIAGRAMS.......................................................................................................................... 16
9. ABSOLUTE MAXIMUM RATINGS....................................................................................................19
9.1 Operating Conditions................................................................................................................... 20
10. ELECTRICAL CHARACTERISTICS............................................................................................... 21
10.1. Parameters For Packaged Parts.............................................................................................. 21
10.1.1. Typical Parameter Variation with Voltage and Temperature - Packaged Parts................ 24
10.2. Parameters For Die .................................................................................................................. 25
10.2.1. Typical Parameter Variation with Voltage and Temperature - Die .................................... 28
10.3. Parameters For Push-Button Mode..........................................................................................29
11. TYPICAL APPLICATION CIRCUIT................................................................................................. 30
12. PACKAGE DRAWING AND DIMENSIONS.................................................................................... 35
12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 35
12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP)............................................................... 36
12.3. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1................................ 37
12.4. Die Bonding Physical Layout
[1]
................................................................................................ 38
14. VERSION HISTORY ....................................................................................................................... 41
- 4 -
相關(guān)PDF資料
PDF描述
ISD2532P SINGLE-CHIP, MULTIPLE-MESSAGES, VOICE RECORD/PLAYBACK DEVICE 32-, 40-, 48-, AND 64-SECOND DURATION
ISD2532S SINGLE-CHIP, MULTIPLE-MESSAGES, VOICE RECORD/PLAYBACK DEVICE 32-, 40-, 48-, AND 64-SECOND DURATION
ISD2532X SINGLE-CHIP, MULTIPLE-MESSAGES, VOICE RECORD/PLAYBACK DEVICE 32-, 40-, 48-, AND 64-SECOND DURATION
ISD2340 SINGLE-CHIP, MULTIPLE-MESSAGES, VOICE RECORD/PLAYBACK DEVICE 32-, 40-, 48-, AND 64-SECOND DURATION
ISD2540E SINGLE-CHIP, MULTIPLE-MESSAGES, VOICE RECORD/PLAYBACK DEVICE 32-, 40-, 48-, AND 64-SECOND DURATION
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISD2532EI 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Solid-State Recorder
ISD2532P 功能描述:IC VOICE REC/PLAY 32SEC 28-PDIP RoHS:否 類別:集成電路 (IC) >> 接口 - 語音錄制和重放 系列:ISD2500 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000
ISD2532PI 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Solid-State Recorder
ISD2532PRODUCTS 制造商:未知廠家 制造商全稱:未知廠家 功能描述:
ISD2532PY 功能描述:IC MEM VOICE REC/PLAY 32S 28-DIP RoHS:是 類別:集成電路 (IC) >> 接口 - 語音錄制和重放 系列:ISD2500 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*