參數(shù)資料
型號(hào): ISD17210SYR
廠商: WINBOND ELECTRONICS CORP
英文描述: R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 32K; RAM: 2K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A)
中文描述: 多信息單芯片語(yǔ)音記錄
文件頁(yè)數(shù): 22/24頁(yè)
文件大?。?/td> 365K
代理商: ISD17210SYR
ISD1700 SERIES
- 22 -
12 ORDERING INFORMATION
Product Number Descriptor Key
50
:
33 – 100 secs
When ordering ISD1700 devices, please refer to the above ordering scheme. Contact the local Winbond
Sales Representatives for any questions and the availability.
For the latest product information, please contact the Winbond Sales/Rep or
access Winbond’s worldwide web site at
http://www.winbond-usa.com
I17xxx
x
x
x
x
xx
Product Series:
17 = 1700
Duration:
30
:
20 – 60 secs
40
:
26 – 80 secs
60
:
40 – 120 secs
90
:
60 – 180 secs
120
:
80 – 240 secs
150
:
100 – 300 secs
180
:
120 – 360 secs
210
:
140 – 420 secs
240
:
160 – 480 secs
Package Type
:
X
= Die
E
= Thin Small Outline Package (TSOP)
S
= Small Outline Integrated Circuit
(SOIC) Package
P
= Plastic Dual Inline Package (PDIP)
Temperature
:
I
= Industrial (-40
°
C to +85
°
C)
Blank
= Commercial
Die (0
°
C to +50
°
C)
Package (0
°
C to +70
°
C)
Special Features Field
:
Blank = None
01
= vAlert
Tape & Reel:
Blank = None
R = Tape & Reel
Lead-Free
:
Y
= Lead-Free
Product Name:
I = ISD
相關(guān)PDF資料
PDF描述
ISD17210SYR01 R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 32K; RAM: 2K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 62.5 (@16MHz); Operating Frequency / Supply Voltage: 16MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 125; Package Code: PLQP0048KB-A (48P6Q-A)
ISD17210XY R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 48K; RAM: 2.5K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A)
ISD17210XY01 R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 48K; RAM: 2.5K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A)
ISD17210XYI R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 48K; RAM: 2.5K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 62.5 (@16MHz); Operating Frequency / Supply Voltage: 16MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 125; Package Code: PLQP0048KB-A (48P6Q-A)
ISD17210XYI01 R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 64K; RAM: 3K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISD17210SYR01 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XY 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XY01 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYI 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XYI01 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices