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參數(shù)資料
| 型號： | ISD17210SYIR01 |
| 廠商： | WINBOND ELECTRONICS CORP |
| 英文描述： | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 32K; RAM: 2K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A) |
| 中文描述： | 多信息單芯片語音記錄 |
| 文件頁數(shù)： | 18/24頁 |
| 文件大?。?/td> | 365K |
| 代理商： | ISD17210SYIR01 |
ISD1700 SERIES
- 18 -
Example #3: Connecting the SPI Interface to a microcontroller
ISD1700
R
OSC
ERASE
PLAY
REC
AGC
AnaIn
MIC -
MIC+
MISO
MOSI
SCLK
SS
FWD
VOL
FT
24
23
25
26
19
10
11
20
18
22
9
7
6
5
4
*** At 8kHz sampling freq, Rosc = 80 K
Rosc ***
4.7 F
0.1 F
To uC
SPI
: Digital ground; : Analog ground; : Ground for SP+; : Ground for SP-
Vcc Gnd
**
V
CCA
V
SSA
V
CCP
V
SSP1
V
SSP2
SP+
AUD/AUX
V
SSD
V
CCD
V
CCA
0.1 F
μ
LED
1 K
Ω
V
CCD
*
D1
2
1
28
17
V
CCA
V
CCD
V
CCP
SP-
V
CCP
0.1 F
0.1 F
*
*
21
8
14
16
12
0.1 F
*
INT/RDY
27
**
15
13
Speaker
or Buzzer
V
CCD
Optional
Ω
100 K
vAlert
Optional: based upon the applications
390
Ω
0.1 F
V
CC
8050C
Speaker
AUX
AUD
3
RESET
0.1 F
Reset
10.1
G
OOD
A
UDIO
D
ESIGN
P
RACTICES
To ensure the highest quality of voice reproduction, it is important to follow good audio design
practices in layout and power supply decoupling. See recommendations from below links or other
Application Notes in our websites.
Design Considerations for ISD1700 Family
AN-CC1002 Design Considerations for ISD1700 Family.pdf
Good Audio Design Practices
http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf
Single-Chip Board Layout Diagrams
http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf
相關PDF資料 |
PDF描述 |
|---|---|
| ISD17210SYR | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 32K; RAM: 2K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A) |
| ISD17210SYR01 | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 32K; RAM: 2K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 62.5 (@16MHz); Operating Frequency / Supply Voltage: 16MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 125; Package Code: PLQP0048KB-A (48P6Q-A) |
| ISD17210XY | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 48K; RAM: 2.5K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A) |
| ISD17210XY01 | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 48K; RAM: 2.5K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A) |
| ISD17210XYI | R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 48K; RAM: 2.5K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 62.5 (@16MHz); Operating Frequency / Supply Voltage: 16MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 125; Package Code: PLQP0048KB-A (48P6Q-A) |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| ISD17210SYR | 功能描述:IC VOICE REC/PLAY 210SEC 28-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 語音錄制和重放 系列:ISD1700, ChipCorder® 標準包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應商設備封裝:28-PDIP 其它名稱:90-21300+000 |
| ISD17210SYR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210XY | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210XY01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210XYI | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
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