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參數(shù)資料
| 型號： | ISD17210EYIR |
| 廠商： | WINBOND ELECTRONICS CORP |
| 英文描述： | Multi-Message Single-Chip Voice Record & Playback Devices |
| 中文描述： | 多信息單芯片語音記錄 |
| 文件頁數(shù)： | 24/24頁 |
| 文件大?。?/td> | 365K |
| 代理商： | ISD17210EYIR |
ISD1700 SERIES
- 24 -
Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment
intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation
instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or
sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could
result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Winbond for any damages resulting from such improper use or sales.
The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no
representation or warranties with respect to the accuracy or completeness of the contents of this publication and
reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice.
No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this
publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability
whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or
infringement of any Intellectual property.
The contents of this document are provided “AS IS”, and Winbond assumes no liability whatsoever and disclaims any
express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual
property. In no event, shall Winbond be liable for any damages whatsoever (including, without limitation, damages for
loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this
documents, even if Winbond has been advised of the possibility of such damages.
Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only
and Winbond makes no representation or warranty that such applications shall be suitable for the use specified.
The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in
the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates
SuperFlash
.
This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD
ChipCorder
product specifications. In the event any inconsistencies exist between the information in this and other product
documentation, or in the event that other product documentation contains information in addition to the information in
this, the information contained herein supersedes and governs such other information in its entirety. This datasheet is
subject to change without notice.
Copyright
2005, Winbond Electronics Corporation. All rights reserved. ChipCorder
and ISD
are trademarks of
Winbond Electronics Corporation. SuperFlash
is the trademark of Silicon Storage Technology, Inc. All other trademarks
are properties of their respective owners.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISD17210EYIR01 | Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210EYR | Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210EYR01 | Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210PY | Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210PY01 | Multi-Message Single-Chip Voice Record & Playback Devices |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISD17210EYIR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210EYR | 功能描述:IC VOICE REC/PLAY 210SEC 28-TSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 語音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000 |
| ISD17210EYR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17210PY | 功能描述:IC VOICE REC/PLAY 210SEC 28-DIP RoHS:是 類別:集成電路 (IC) >> 接口 - 語音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000 |
| ISD17210PY01 | 功能描述:IC VOICE REC/PLAY 210SEC 28-DIP RoHS:是 類別:集成電路 (IC) >> 接口 - 語音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000 |
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