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參數(shù)資料
| 型號： | ISD17180XY |
| 廠商： | WINBOND ELECTRONICS CORP |
| 英文描述： | Multi-Message Single-Chip Voice Record & Playback Devices |
| 中文描述： | 多信息單芯片語音記錄 |
| 文件頁數(shù)： | 20/24頁 |
| 文件大小： | 365K |
| 代理商： | ISD17180XY |
ISD1700 SERIES
- 20 -
11.2 28-L
EAD
300-M
IL
P
LASTIC
S
MALL
O
UTLINE
I
NTEGRATED
C
IRCUIT
(SOIC)
28 27 26 25 24 23 22 21 20 19 18 17 16 15
1
2
3 4
5
6
7
8 9 10 11 12 13 14
A
D
E
F
B
G
C
H
Min
0.701
0.097
0.292
0.005
0.014
Nom
0.706
0.101
0.296
0.009
0.016
0.050
0.406
0.032
Max
0.711
0.104
0.299
0.0115
0.019
Min
17.81
2.46
7.42
0.127
0.35
Nom
17.93
2.56
7.52
0.22
0.41
1.27
10.31
0.81
Max
18.06
2.64
7.59
0.29
0.48
A
B
C
D
E
F
G
H
0.400
0.024
0.410
0.040
10.16
0.61
10.41
1.02
Note:
Lead coplanarity to be within 0.004 inches.
Plastic Small Outline Integrated Circuit (SOIC) Dimensions
INCHES
MILLIMETERS
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISD17180XY01 | Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17180XYI | Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17180XYI01 | Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17180XYIR | Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17180XYIR01 | Multi-Message Single-Chip Voice Record & Playback Devices |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISD17180XY01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17180XYI | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17180XYI01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17180XYIR | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17180XYIR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
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