參數(shù)資料
型號(hào): ISD17180XY01
廠(chǎng)商: WINBOND ELECTRONICS CORP
英文描述: Multi-Message Single-Chip Voice Record & Playback Devices
中文描述: 多信息單芯片語(yǔ)音記錄
文件頁(yè)數(shù): 20/24頁(yè)
文件大?。?/td> 365K
代理商: ISD17180XY01
ISD1700 SERIES
- 20 -
11.2 28-L
EAD
300-M
IL
P
LASTIC
S
MALL
O
UTLINE
I
NTEGRATED
C
IRCUIT
(SOIC)
28 27 26 25 24 23 22 21 20 19 18 17 16 15
1
2
3 4
5
6
7
8 9 10 11 12 13 14
A
D
E
F
B
G
C
H
Min
0.701
0.097
0.292
0.005
0.014
Nom
0.706
0.101
0.296
0.009
0.016
0.050
0.406
0.032
Max
0.711
0.104
0.299
0.0115
0.019
Min
17.81
2.46
7.42
0.127
0.35
Nom
17.93
2.56
7.52
0.22
0.41
1.27
10.31
0.81
Max
18.06
2.64
7.59
0.29
0.48
A
B
C
D
E
F
G
H
0.400
0.024
0.410
0.040
10.16
0.61
10.41
1.02
Note:
Lead coplanarity to be within 0.004 inches.
Plastic Small Outline Integrated Circuit (SOIC) Dimensions
INCHES
MILLIMETERS
相關(guān)PDF資料
PDF描述
ISD17180XYI Multi-Message Single-Chip Voice Record & Playback Devices
ISD17180XYI01 Multi-Message Single-Chip Voice Record & Playback Devices
ISD17180XYIR Multi-Message Single-Chip Voice Record & Playback Devices
ISD17180XYIR01 Multi-Message Single-Chip Voice Record & Playback Devices
ISD17180XYR Multi-Message Single-Chip Voice Record & Playback Devices
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISD17180XYI 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17180XYI01 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17180XYIR 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17180XYIR01 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17180XYR 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices