• 參數(shù)資料
    型號(hào): ISD17150XYIR
    廠商: WINBOND ELECTRONICS CORP
    英文描述: Multi-Message Single-Chip Voice Record & Playback Devices
    中文描述: 多信息單芯片語(yǔ)音記錄
    文件頁(yè)數(shù): 5/24頁(yè)
    文件大?。?/td> 365K
    代理商: ISD17150XYIR
    ISD1700 SERIES
    Publication Release Date: January 23, 2007
    - 5 -
    Revision 1.3-S2
    y
    Temperature options:
    o
    Commercial: 0
    °
    C to +50
    °
    C (die); 0
    °
    C to +70
    °
    C (packaged units)
    o
    Industrial: -40
    °
    C to +85
    °
    C (packaged units)
    y
    Packaging types: available in die, PDIP, SOIC and TSOP
    y
    Package option: Lead-free packaged units
    3 BLOCK DIAGRAM
    Internal
    Clock
    Timing
    Nonvolatile
    Multi-Level Storage
    Array
    Power Conditioning
    Automatic
    Gain Control
    Anti-
    Aliasing
    Filter
    Smoothing
    Filter
    Sampling
    Clock
    SP+
    SP-
    V
    CCA
    AGC
    MIC-
    MIC+
    R
    OSC
    AUD /
    AUX
    Amp
    V
    CCD
    V
    SSD
    Device Control
    V
    SSA
    V
    SSP1
    V
    CCP
    SPI Interface
    MISO
    MOSI
    SCLK
    SS
    REC
    PLAY ERASE
    FT
    Volume
    Control
    AnaIn
    Amp
    M
    AGC
    Amp
    AnaIn
    Amp
    V
    SSP2
    FWD
    VOL
    LED
    INT/RDY
    RESET
    相關(guān)PDF資料
    PDF描述
    ISD17150XYIR01 Multi-Message Single-Chip Voice Record & Playback Devices
    ISD17150XYR Multi-Message Single-Chip Voice Record & Playback Devices
    ISD17150XYR01 Multi-Message Single-Chip Voice Record & Playback Devices
    ISD17180 Multi-Message Single-Chip Voice Record & Playback Devices
    ISD17180EY Multi-Message Single-Chip Voice Record & Playback Devices
    相關(guān)代理商/技術(shù)參數(shù)
    參數(shù)描述
    ISD17150XYIR01 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
    ISD17150XYR 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
    ISD17150XYR01 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
    ISD17180 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
    ISD17180EY 功能描述:IC VOICE REC/PLAY 180SEC 28-TSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 接口 - 語(yǔ)音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類(lèi)型:通孔 封裝/外殼:28-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱(chēng):90-21300+000