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參數(shù)資料
| 型號： | ISD17120XYI |
| 廠商： | WINBOND ELECTRONICS CORP |
| 英文描述： | Multi-Message Single-Chip Voice Record & Playback Devices |
| 中文描述： | 多信息單芯片語音記錄 |
| 文件頁數(shù)： | 5/24頁 |
| 文件大?。?/td> | 365K |
| 代理商： | ISD17120XYI |
ISD1700 SERIES
Publication Release Date: January 23, 2007
- 5 -
Revision 1.3-S2
y
Temperature options:
o
Commercial: 0
°
C to +50
°
C (die); 0
°
C to +70
°
C (packaged units)
o
Industrial: -40
°
C to +85
°
C (packaged units)
y
Packaging types: available in die, PDIP, SOIC and TSOP
y
Package option: Lead-free packaged units
3 BLOCK DIAGRAM
Internal
Clock
Timing
Nonvolatile
Multi-Level Storage
Array
Power Conditioning
Automatic
Gain Control
Anti-
Aliasing
Filter
Smoothing
Filter
Sampling
Clock
SP+
SP-
V
CCA
AGC
MIC-
MIC+
R
OSC
AUD /
AUX
Amp
V
CCD
V
SSD
Device Control
V
SSA
V
SSP1
V
CCP
SPI Interface
MISO
MOSI
SCLK
SS
REC
PLAY ERASE
FT
Volume
Control
AnaIn
Amp
M
AGC
Amp
AnaIn
Amp
V
SSP2
FWD
VOL
LED
INT/RDY
RESET
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISD17120XYI01 | Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17120XYIR | Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17120XYIR01 | Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17120XYR | Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17120XYR01 | Multi-Message Single-Chip Voice Record & Playback Devices |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISD17120XYI01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17120XYIR | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17120XYIR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17120XYR | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
| ISD17120XYR01 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices |
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