參數(shù)資料
型號(hào): ISD17120SYR01
廠商: WINBOND ELECTRONICS CORP
英文描述: Multi-Message Single-Chip Voice Record & Playback Devices
中文描述: 多信息單芯片語音記錄
文件頁數(shù): 20/24頁
文件大小: 365K
代理商: ISD17120SYR01
ISD1700 SERIES
- 20 -
11.2 28-L
EAD
300-M
IL
P
LASTIC
S
MALL
O
UTLINE
I
NTEGRATED
C
IRCUIT
(SOIC)
28 27 26 25 24 23 22 21 20 19 18 17 16 15
1
2
3 4
5
6
7
8 9 10 11 12 13 14
A
D
E
F
B
G
C
H
Min
0.701
0.097
0.292
0.005
0.014
Nom
0.706
0.101
0.296
0.009
0.016
0.050
0.406
0.032
Max
0.711
0.104
0.299
0.0115
0.019
Min
17.81
2.46
7.42
0.127
0.35
Nom
17.93
2.56
7.52
0.22
0.41
1.27
10.31
0.81
Max
18.06
2.64
7.59
0.29
0.48
A
B
C
D
E
F
G
H
0.400
0.024
0.410
0.040
10.16
0.61
10.41
1.02
Note:
Lead coplanarity to be within 0.004 inches.
Plastic Small Outline Integrated Circuit (SOIC) Dimensions
INCHES
MILLIMETERS
相關(guān)PDF資料
PDF描述
ISD17120XY Multi-Message Single-Chip Voice Record & Playback Devices
ISD17120XY01 Multi-Message Single-Chip Voice Record & Playback Devices
ISD17120XYI Multi-Message Single-Chip Voice Record & Playback Devices
ISD17120XYI01 Multi-Message Single-Chip Voice Record & Playback Devices
ISD17120XYIR Multi-Message Single-Chip Voice Record & Playback Devices
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISD17120XY 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17120XY01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17120XYI 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17120XYI01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17120XYIR 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices