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參數(shù)資料
| 型號： | IS9-705RH-8 |
| 廠商： | INTERSIL CORP |
| 元件分類： | 電源管理 |
| 英文描述： | Radiation Hardened Power-Up/Down Microprocessor Reset Circuit |
| 中文描述： | 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, CDFP8 |
| 封裝： | GREEN, CERAMIC, DFP-8 |
| 文件頁數(shù)： | 2/2頁 |
| 文件大?。?/td> | 499K |
| 代理商： | IS9-705RH-8 |
2
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
Die Characteristics
DIE DIMENSIONS:
1500
μ
m x 1830
μ
m (59 mils x 72 mils)
Thickness: 483
μ
m
±
25.4
μ
m (19 mils
±
1 mil)
INTERFACE MATERIALS
Glassivation
Type: Nitride (Si
3
N
4
) over Silox (SiO
2
)
Nitride Thickness: 4.0k
±
1.0k
Silox Thickness: 12.0k
±
4.0k
Top Metallization
Top Metal 3: TiAlCu
Thickness: 0.8
μ
m
±
0.02
μ
m
Metal 1 and 2: TiAlCu
Thickness: 0.4
μ
m
±
0.01
μ
m
Substrate:
UHF2X-CMOS
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION
Substrate Potential:
Backside internally connected to GND
(May be left floating or connected to GND.)
ADDITIONAL INFORMATION
Worst Case Current Density:
<2.0 x 10
5
A/cm
2
Metallization Mask Layout
IS-705RH
NOTES:
1. Octagonal trim pads should be left unconnected.
VCC (2)
GND (3)
PFI (4)
PFO (5)
WDI (6)
RESET (7)
WDO (8)
MR (1)
IS-705RH
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| IS0-705RH-Q | Radiation Hardened Power-Up/Down Microprocessor Reset Circuit |
| IS9-705RH-Q | Radiation Hardened Power-Up/Down Microprocessor Reset Circuit |
| IS1A | Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere |
| IS1B | Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere |
| IS1D | Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IS9-705RH-Q | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Power-Up/Down Microprocessor Reset Circuit |
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