- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄384511 > IS7-1845ASRH-8 (INTERSIL CORP) Circular Connector; MIL SPEC:MIL-C-5015 A/B/C; Body Material:Aluminum Alloy; Series:MS3102; No. of Contacts:5; Connector Shell Size:18; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No PDF資料下載
參數(shù)資料
| 型號(hào)： | IS7-1845ASRH-8 |
| 廠商： | INTERSIL CORP |
| 元件分類(lèi)： | 穩(wěn)壓器 |
| 英文描述： | Circular Connector; MIL SPEC:MIL-C-5015 A/B/C; Body Material:Aluminum Alloy; Series:MS3102; No. of Contacts:5; Connector Shell Size:18; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No |
| 中文描述： | 1 A SWITCHING CONTROLLER, 500 kHz SWITCHING FREQ-MAX, CDIP8 |
| 封裝： | SIDE BRAZED, CERAMIC, DIP-8 |
| 文件頁(yè)數(shù)： | 2/2頁(yè) |
| 文件大?。?/td> | 57K |
| 代理商： | IS7-1845ASRH-8 |
2
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
Die Characteristics
DIE DIMENSIONS
3090
μ
m x 4080
μ
m (121.6 mils x 159.0 mils)
Thickness: 483
μ
m
±
25.4
μ
m (19 mils
±
1 mil)
INTERFACE MATERIALS
Glassivation
Type: Phosphorus Silicon Glass (PSG)
Thickness: 8.0kA
±
1.0kA
Top Metallization
Type: AlSiCu
Thickness: 16.0kA
±
2kA
Substrate
Radiation Hardened Silicon Gate,
Dielectric Isolation
Backside Finish
Silicon
ASSEMBLY RELATED INFORMATION
Substrate Potential
Unbiased (DI)
ADDITIONAL INFORMATION
Worst Case Current Density
<2.0 x 10
5
A/cm
2
Transistor Count
582
Metallization Mask Layout
IS-1845ASRH
NOTES:
3. Both the GND pads must be bonded to ground.
4. The OUT double-sized bond pad must be double bonded for
current sharing purposes.
5. The OSCGND double-sized bond pad must be double bonded to
ground for current sharing purposes.
VFB
COMP
VREF
VC
VCC
OUT
GND
GND
OSCGND
RTCT
ISENSE
IS-1845ASRH
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| IS9-1845ASRH-8 | Single Event Radiation Hardened High Speed, Current Mode PWM |
| IS7-1845ASRH-Q | Single Event Radiation Hardened High Speed, Current Mode PWM |
| IS9-1845ASRH-Q | Single Event Radiation Hardened High Speed, Current Mode PWM |
| IS-2100ARH | RES POWER .036 OHM 3W 5% SMT |
| IS9-2100ARH-8 | Radiation Hardened High Frequency Half Bridge Driver |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| IS7-1845ASRH-Q | 制造商:Intersil Corporation 功能描述:CURRENT MODE PWM CNTRLR 1A 8PIN SBCDIP - Bulk |
| IS71K | 制造商:IDEC CORPORATION 功能描述:SENS.IND. 10-30VDC PNP NC |
| IS71KS | 制造商:IDEC CORPORATION 功能描述:SENS.IND. 10-30VDC PNP NC |
| IS71L | 制造商:IDEC CORPORATION 功能描述:SENS.IND. 10-30VDC PNP NC |
| IS71LD32160WP128-25BPLI | 功能描述:MCP LPDDR2 DRAM 512 MB 制造商:issi, integrated silicon solution inc 系列:- 包裝:散裝 零件狀態(tài):有效 格式 - 存儲(chǔ)器:多芯（FLASH/RAM） 存儲(chǔ)器類(lèi)型:FLASH/LPDDR2 DRAM 存儲(chǔ)容量:128Mb 閃存，512Mb DRAM 速度:133MHz FLASH/533MHz DRAM 接口:并聯(lián) 電壓 - 電源:1.2V，1.8V 工作溫度:-40°C ~ 85°C（TA） 封裝/外殼:* 供應(yīng)商器件封裝:168-BGA 標(biāo)準(zhǔn)包裝:108 |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。