參數(shù)資料
型號: IRF7507PBF
廠商: International Rectifier
英文描述: HEXFET㈢Power MOSFET
中文描述: ㈢的HEXFET功率MOSFET
文件頁數(shù): 1/8頁
文件大小: 224K
代理商: IRF7507PBF
IRF7507PbF
HEXFET Power MOSFET
PD - 95218
Generation V Technology
Ultra Low On-Resistance
Dual N and P Channel MOSFET
Very Small SOIC Package
Low Profile (<1.1mm)
Available in Tape & Reel
Fast Switching
Lead-Free
N-Ch
P-Ch
V
DSS
20V
-20V
R
DS(on)
0.135
0.27
Fifth Generation HEXFETs from International Rectifier utilize advanced
processing techniques to achieve extremely low on-resistance per silicon area.
This benefit, combined with the fast switching speed and ruggedized device
design that HEXFET Power MOSFETs are well known for, provides the
designer with an extremely efficient and reliable device for use in a wide variety
of applications.
The new Micro8 package, with half the footprint area of the standard SO-8,
provides the smallest footprint available in an SOIC outline. This makes the
Micro8 an ideal device for applications where printed circuit board space is at
a premium. The low profile (<1.1mm) of the Micro8 will allow it to fit easily into
extremely thin application environments such as portable electronics and
PCMCIA cards.
Description
www.irf.com
1
Parameter
Max.
Units
N-Channel P-Channel
V
DS
Drain-Source Voltage 20 -20 V
I
D
@ T
A
= 25°C
Continuous Drain Current, V
GS
2.4 -1.7
I
D
@ T
A
= 70°C
Continuous Drain Current, V
GS
1.9 -1.4
I
DM
Pulsed Drain Current
19 -14
P
D
@T
A
= 25°C
Maximum Power Dissipation
P
D
@T
A
= 70°C
Maximum Power Dissipation
Linear Derating Factor 10 mW/°C
V
GS
Gate-to-Source Voltage
± 12 V
V
GSM
Gate-to-Source Voltage Single Pulse tp<10μS 16 V
dv/dt
Peak Diode Recovery dv/dt
5.0 -5.0
T
J
, T
STG
Junction and Storage Temperature Range
Soldering Temperature, for 10 seconds 240 (1.6mm from case)
A
1.25
0.8
W
W
V/ns
°C
-55 to + 150
Thermal Resistance
Absolute Maximum Ratings
D1
D1
D2
D2
G1
S2
G2
S1
Top View
8
1
2
3
4
5
6
7
N-CHANNEL MOSFET
P-CHANNEL MOSFET
Micro8
R
θ
JA
Maximum Junction-to-Ambient
100 °C/W
Units
Parameter
Max.
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