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    參數(shù)資料
    型號: IRF634NSPbF
    廠商: International Rectifier
    英文描述: HEXFET Power MOSFET
    中文描述: HEXFET功率MOSFET
    文件頁數(shù): 2/11頁
    文件大?。?/td> 233K
    代理商: IRF634NSPBF
    IRF634N/S/LPbF
    2
    www.irf.com
    S
    D
    G
    Parameter
    Min. Typ. Max. Units
    Conditions
    MOSFET symbol
    showing the
    integral reverse
    p-n junction diode.
    T
    J
    = 25°C, I
    S
    = 4.8A, V
    GS
    = 0V
    T
    J
    = 25°C, I
    F
    = 4.8A
    di/dt = 100A/μs
    I
    S
    Continuous Source Current
    (Body Diode)
    Pulsed Source Current
    (Body Diode)
    Diode Forward Voltage
    Reverse Recovery Time
    Reverse Recovery Charge
    Forward Turn-On Time
    –––
    –––
    I
    SM
    –––
    –––
    V
    SD
    t
    rr
    Q
    rr
    t
    on
    –––
    –––
    –––
    –––
    130
    650
    1.3
    200
    980
    V
    ns
    nC
    Intrinsic turn-on time is negligible (turn-on is dominated by L
    S
    +L
    D
    )
    Source-Drain Ratings and Characteristics
    8.0
    32
    Parameter
    Min. Typ. Max. Units
    250
    –––
    –––
    0.33
    –––
    ––– 0.435
    2.0
    –––
    5.4
    –––
    –––
    –––
    –––
    –––
    –––
    –––
    –––
    –––
    –––
    –––
    –––
    –––
    –––
    –––
    –––
    8.4
    –––
    16
    –––
    28
    –––
    15
    Conditions
    V
    GS
    = 0V, I
    D
    = 250μA
    Reference to 25°C, I
    D
    = 1mA
    V
    GS
    = 10V, I
    D
    = 4.8A
    V
    DS
    = V
    GS
    , I
    D
    = 250μA
    V
    DS
    = 50V, I
    D
    = 4.8A
    V
    DS
    = 250V, V
    GS
    = 0V
    V
    DS
    = 200V, V
    GS
    = 0V, T
    J
    = 150°C
    V
    GS
    = 20V
    V
    GS
    = -20V
    I
    D
    = 4.8A
    V
    DS
    = 200V
    V
    GS
    = 10V, See Fig. 6 and 13
    V
    DD
    = 125V
    I
    D
    = 4.8A
    R
    G
    = 1.3
    V
    GS
    = 10V, See Fig. 10
    Between lead,
    6mm (0.25in.)
    from package
    and center of die contact
    V
    GS
    = 0V
    V
    DS
    = 25V
    = 1.0MHz, See Fig. 5
    V
    (BR)DSS
    V
    (BR)DSS
    /
    T
    J
    Breakdown Voltage Temp. Coefficient
    R
    DS(on)
    Static Drain-to-Source On-Resistance
    V
    GS(th)
    Gate Threshold Voltage
    g
    fs
    Forward Transconductance
    Drain-to-Source Breakdown Voltage
    –––
    –––
    V
    V/°C
    V
    S
    4.0
    –––
    25
    250
    100
    -100
    34
    6.5
    16
    –––
    –––
    –––
    –––
    μA
    Gate-to-Source Forward Leakage
    Gate-to-Source Reverse Leakage
    Total Gate Charge
    Gate-to-Source Charge
    Gate-to-Drain ("Miller") Charge
    Turn-On Delay Time
    Rise Time
    Turn-Off Delay Time
    Fall Time
    nA
    Q
    g
    Q
    gs
    Q
    gd
    t
    d(on)
    t
    r
    t
    d(off)
    t
    f
    nC
    –––
    –––
    C
    iss
    C
    oss
    C
    rss
    Input Capacitance
    Output Capacitance
    Reverse Transfer Capacitance
    –––
    –––
    –––
    620
    84
    23
    –––
    –––
    –––
    pF
    nH
    Electrical Characteristics @ T
    J
    = 25°C (unless otherwise specified)
    L
    D
    Internal Drain Inductance
    L
    S
    Internal Source Inductance
    –––
    –––
    S
    D
    G
    I
    GSS
    ns
    4.5
    7.5
    I
    DSS
    Drain-to-Source Leakage Current
    Thermal Resistance
    Parameter
    Typ.
    –––
    0.50
    –––
    –––
    Max.
    1.7
    –––
    62
    40
    Units
    R
    θ
    JC
    R
    θ
    CS
    R
    θ
    JA
    R
    θ
    JA
    Junction-to-Case
    Case-to-Sink, Flat, Greased Surface
    Junction-to-Ambient
    Junction-to-Ambient (PCB mount)
    °C/W
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