參數(shù)資料
型號(hào)： IR2175S
廠商： International Rectifier
英文描述： LINEAR CURRENT SENSING IC
中文描述： 線性電流感應(yīng)集成電路
文件頁數(shù)： 2/7頁
文件大?。?/td> 107K
代理商： IR2175S
2
IR2175
(S) & (PbF)
www.irf.com
Recommended Operating Conditions
The output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recommended
conditions.
Note 1: Capacitors are required between V
B
and Vs when bootstrap power is used. The external power supply,
when used, is required between V
B
and Vs pins.
Symbol Definition
Min.
Max.
Units
V
B
High side floating supply voltage
V
S
+13.0
V
S
+20
V
S
High side floating supply offset voltage
0.3
600
V
PO
Digital PWM output voltage
COM
VCC
V
OC
Overcurrent output voltage
COM
VCC
V
CC
Low side and logic fixed supply voltage
9.5
20
V
IN
Input voltage between V
IN+
and V
S
-260
+260
mV
T
A
Ambient temperature
-40
125
°
C
V
Symbol Definition
Min.
Max.
Units
V
S
High side offset voltage
-0.3
600
V
BS
High side floating supply voltage
-0.3
25
V
CC
Low side and logic fixed supply voltage
-0.3
25
V
IN
Maximum input voltage between V
IN+ and
V
S
-5
5
V
PO
Digital PWM output voltage
COM -0.3
VCC +0.3
V
OC
Overcurrent output voltage
COM -0.3
VCC +0.3
dV/dt
Allowable offset voltage slew rate
—
50
V/ns
P
D
Package power dissipation @ T
A
≤
+25
°
C
8 lead SOIC
—
.625
8 lead PDIP
—
1.0
Rth
JA
Thermal resistance, junction to ambient
8 lead SOIC
—
200
8 lead PDIP
—
125
T
J
Junction temperature
—
150
T
S
Storage temperature
-55
150
T
L
Lead temperature (soldering, 10 seconds)
—
300
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal
resistance and power dissipation ratings are measured under board mounted and still air conditions.
V
°
C/W
W
°
C
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