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參數(shù)資料
| 型號： | IP175 |
| 英文描述： | 5-port 10/100M Single Chip Switch |
| 中文描述： | 5端口10/100M自適應(yīng)單片開關(guān) |
| 文件頁數(shù)： | 10/29頁 |
| 文件大?。?/td> | 202K |
| 代理商： | IP175 |
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IP175
PIN Description
(continued)
Pin no.
External MII interface
60
61-64
65
66
Preliminary, Specification subject to change without notice
IP175-DS-P05
Jul. 19, 2002
10
Label
Type
Description
MTXEN
MTXD[3:0]
MTXER
MII_CLK
I
I
I
O
MTXEN is used to frame NRZ data from external MII device
MTXD is NRZ data from external MAC controller
MTXER is transmit error
MII_CLK is MII interface clock
It is the MIITxclk of switch core and is used as MIITxclk and
MIIRxclk for the external MAC device
MRXDV is used to frame MRXD, which is sent to external
MAC device
MRXD is NRZ data to external MAC device
MCOL is active, only if both MRXDV and MTXEN are both
active and the MII interface is set to be half-duplex
67
MRXDV
O
68-71
72
MRXD[3:0]
MCOL
O
O
Power
5,25,43
VCC
I
Tx VCC of Analog circuit
It is connected to 2.5v.
Rx VCC of Analog circuit
It is connected to 2.5v.
Band gap VCC of Analog circuit
It is connected to 2.5v.
VCC of digital core
It is connected to 2.5v.
VCC of crystal
It is connected to 2.5v.
VCC of digital I/O buffer
It is connected to 2.5v for a dumb switch. It should be
connected to 3.3v if external MII interface is active.
VCC of SRAM
It is connected to 2.5v.
VCC of digital I/O buffer
It is connected to 2.5v for a dumb switch. It should be
connected to 3.3v if external MII interface is active.
Tx GND of Analog circuit
Rx GND of Analog circuit
10,20,30,37,127 VCC
I
14
VCC
I
49,50,53,58,79,
110,117,118
114
VCC
I
VCC
I
73
VCC_IO_2
I
94
VCC_SRAM
I
100
VCC_IO_1
I
4,6,24,26,42
13,17,33,34,38,12
4,128
16
48,51,52,59,80,11
5, 116,119
111
74
95
101
GND
GND
I
I
GND
GND
I
I
Band gap GND of Analog circuit
GND of digital core
GND
GND_IO_2
GND_SRAM
GND_IO_1
I
I
I
I
GND of crystal
GND of digital I/O buffer
GND of SRAM
GND of digital I/O buffer
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