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參數(shù)資料
| 型號： | IM04GR |
| 英文描述： | The Best Relaytion |
| 中文描述： | 最佳Relaytion |
| 文件頁數(shù)： | 6/10頁 |
| 文件大小： | 610K |
| 代理商： | IM04GR |
6
General data
Operate time at
U
nom
typ. / max.
Reset time (latching) at
U
nom
, typ. / max.
Release time without diode in parallel (non-latching), typ. / max.
Release time with diode in parallel (non-latching), typ. / max.
Bounce time at closing contact, typ. / max.
Maximum switching rate without load
Ambient temperature
Thermal resistance
Maximum permissible coil temperature
Vibration resistance (function)
Shock resistance, half sinus, 11 ms
half sinus, 0.5 ms
Degree of protection
Needle flame test
Mounting position
Processing information
Weight (mass)
Resistance to soldering heat
1 ms / 3 ms
1 ms /3 ms
1 ms / 3 ms
3 ms / 5 ms
1 ms / 5 ms
50 operations/s
-40° C ... +85° C
< 150 K/W
125° C
20 G
10 to 1000 Hz
50 G (function)
500 G (damage)
immersion cleanable, IP 67
application time 20 s, no burning and glowing
any
Ultrasonic cleaning is not recommended
max. 0.75 g
260° C / 10 s
IM Relay
All data refers to 23° C unless otherwise specified.
Recommended soldering conditions
Soldering conditions according CECC 00802
Vapor Phase Soldering: Temperature/Time Profile
(Lead Temperature)
Infrared Soldering: Temperature/Time Profile
(Lead Temperature)
Full line:
Dotted line: process limits
typical
10 sec
ca. 40 sec
max. 245° C
215° C
180° C
130° C
Time (s)
215° C
180° C
130° C
external preheating
100° C
20 - 40 sec
Full line:
Dotted line: process limits
typical
forced
cooling
Time (s)
T
T
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