IDT72V3622/72V3632/72V3642 CMOS 3.3V SyncBiFIFOTM 256 x 36 x 2, 512 x 36 x 2, 1,024 x 36 x 2 COMMERC" />
參數(shù)資料
型號(hào): IDT72V3642L10PF8
廠商: IDT, Integrated Device Technology Inc
文件頁數(shù): 19/29頁
文件大?。?/td> 0K
描述: IC FIFO 1MX72 10NS 120QFP
標(biāo)準(zhǔn)包裝: 750
系列: 72V
功能: 同步
存儲(chǔ)容量: 72k(1k x 36 x 2)
數(shù)據(jù)速率: 100MHz
訪問時(shí)間: 10ns
電源電壓: 3 V ~ 3.6 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 120-LQFP
供應(yīng)商設(shè)備封裝: 120-TQFP(14x14)
包裝: 帶卷 (TR)
其它名稱: 72V3642L10PF8
26
IDT72V3622/72V3632/72V3642 CMOS 3.3V SyncBiFIFOTM
256 x 36 x 2, 512 x 36 x 2, 1,024 x 36 x 2
COMMERCIAL TEMPERATURERANGE
NOTES:
1. tSKEW2 is the minimum time between a rising CLKB edge and a rising CLKA edge for AFB to transition HIGH in the next CLKB cycle. If the time between the rising CLKB edge and rising
CLKA edge is less than tSKEW2, then AFB may transition HIGH one CLKB cycle later than shown.
2. FIFO2 write (CSB = LOW, W/RB = LOW, MBB = LOW), FIFO2 read (CSA = LOW, W/RA = LOW, MBA = LOW). Data in the FIFO2 output register has been read from the FIFO.
3. D = Maximum FIFO Depth = 256 for the IDT72V3622, 512 for the IDT72V3632, 1,024 for the IDT72V3642.
Figure 19. Timing for AFB
AFB
AFB when FIFO2 is Almost-Full (IDT Standard and FWFT Modes)
Figure 20. Timing for Mail1 Register and MBF1
MBF1
MBF1 Flag (IDT Standard and FWFT Modes)
AFB
CLKB
ENA
4660 drw 21
ENB
CLKA
12
tSKEW2
tENS2
tENH
tPAF
tENS2
tENH
tPAF
[D-(Y2+1)] Words in FIFO2
(D-Y2) Words in FIFO2
(1)
4660 drw 22
CLKA
ENA
A0 - A35
MBA
CSA
W/
RA
CLKB
MBF1
CSB
MBB
ENB
B0 - B35
W/RB
W1
tENS1
tENH
tDS
tDH
tPMF
tEN
tMDV
tPMR
tENS2
tENH
tDIS
W1 (Remains valid in Mail1 Register after read)
FIFO1 Output Register
tENS1
tENS2
tENH
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