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參數(shù)資料
| 型號(hào)： | ICS8S89831AKILFT |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁(yè)數(shù)： | 7/21頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC CLOCK BUFFER 1:4 2.1GHZ 16QFN |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 系列： | HiPerClockS™ |
| 類(lèi)型： | 扇出緩沖器（分配） |
| 電路數(shù)： | 1 |
| 比率 - 輸入:輸出： | 1:4 |
| 差分 - 輸入:輸出： | 是/是 |
| 輸入： | CML，LVDS，LVPECL，SSTL |
| 輸出： | ECL，LVPECL |
| 頻率 - 最大： | 2.1GHz |
| 電源電壓： | 2.375 V ~ 3.465 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 16-VFQFN 裸露焊盤(pán) |
| 供應(yīng)商設(shè)備封裝： | 16-VFQFPN（3x3） |
| 包裝： | 帶卷 (TR) |
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ICS8S89831I Data Sheet
DIFFERENTIAL LVPECL-TO-LVPECL/ECL FANOUT BUFFER
ICS8S89831AKI REVISION A APRIL 26, 2010
15
2010 Integrated Device Technology, Inc.
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS8S89831I.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS8S89831I is the sum of the core power plus the power dissipation in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipation in the load.
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 45mA = 155.925mW
Power (outputs)MAX = 32.94mW/Loaded Output pair
If all outputs are loaded, the total power is 4 * 32.94mW = 131.76mW
Power Dissipation for internal termination RT
Power (RT)MAX = (VIN_MAX)
2 / RT_MIN = (1.2V)2 / 80 = 18mW
Total Power_MAX (3.3V, with all outputs switching) = 155.925mW + 131.76mW + 18mW = 305.685mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad, and directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 74.7°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.306W * 74.7°C/W = 107.9°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 6. Thermal Resistance θJA for 16 Lead VFQFN, Forced Convection
θ
JA by Velocity
Meters per Second
01
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
74.7°C/W
65.3°C/W
58.5°C/W
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| ICS8S89834AKILF | 功能描述:IC CLOCK MUX 2:4 1GHZ 16-VFQFN RoHS:是 類(lèi)別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘緩沖器，驅(qū)動(dòng)器 系列:HiPerClockS™ 標(biāo)準(zhǔn)包裝:74 系列:- 類(lèi)型:扇出緩沖器（分配） 電路數(shù):1 比率 - 輸入:輸出:1:10 差分 - 輸入:輸出:是/是 輸入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 輸出:HCSL，LVDS 頻率 - 最大:400MHz 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:32-VFQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:32-QFN（5x5） 包裝:管件 |
| ICS8S89834AKILFT | 功能描述:IC CLOCK MUX 2:4 1GHZ 16-VFQFN RoHS:是 類(lèi)別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘緩沖器，驅(qū)動(dòng)器 系列:HiPerClockS™ 標(biāo)準(zhǔn)包裝:74 系列:- 類(lèi)型:扇出緩沖器（分配） 電路數(shù):1 比率 - 輸入:輸出:1:10 差分 - 輸入:輸出:是/是 輸入:HCSL, LVCMOS, LVDS, LVPECL, LVTTL 輸出:HCSL，LVDS 頻率 - 最大:400MHz 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類(lèi)型:表面貼裝 封裝/外殼:32-VFQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:32-QFN（5x5） 包裝:管件 |
| ICS8S89875AKILF | 制造商:Integrated Device Technology Inc 功能描述:IC CLK MULTPLX 1:2 2.5GHZ 16VFQF |
| ICS8S89875AKILFT | 制造商:Integrated Device Technology Inc 功能描述:IC CLK MULTPLX 1:2 2.5GHZ 16VFQF |
| ICS90C61A-PR2M | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:Video/Graphics Clock Generator |
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