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| 型號(hào)： | ICS8535AGI-31T |
| 廠商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分類： | XO, clock |
| 英文描述： | LOW SKEW, 1-TO-4, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER |
| 中文描述： | 266 MHz, OTHER CLOCK GENERATOR, PDSO20 |
| 封裝： | 6.50 X 4.40 MM, 0.92 MM HEIGHT, MO-153, TSSOP-20 |
| 文件頁數(shù)： | 10/15頁 |
| 文件大?。?/td> | 681K |
| 代理商： | ICS8535AGI-31T |
ICS8535I-31
LOW SKEW, 1-TO-4, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V LVPECL FANOUT BUFFER
IDT / ICS
3.3V LVPECL FANOUT BUFFER
10
ICS8535AGI-31 REV. A
AUGUST 16, 2007
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS8535I-31.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS8535I-31 is the sum of the core power plus the power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 65mA =
225.2mW
Power (outputs)
MAX
=
30mW/Loaded Output Pair
If all outputs are loaded, the total power is 4 * 30mW = 120mW
Total Power
_MAX
(3.465V, with all outputs switching) = 225.2mW + 120mW =
345.2mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA
* Pd_total + T
A
Tj = Junction Temperature
θ
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA
must be used. Assuming a moderate
air flow of 200 linear feet per meter and a multi-layer board, the appropriate value is 66.6°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.345W * 66.6°C/W = 108°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board (single layer or multi-layer).
Table 7. Thermal Resistance
θ
JA
for 20 Lead TSSOP, Forced Convection
θ
JA
by Velocity
0
Linear Feet per minute
200
500
Single-Layer PCB, JEDEC Standard Test Boards
114.5°C/W
98.0°C/W
88.0°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
73.2°C/W
66.6°C/W
63.5°C/W
NOTE:
Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
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