參數(shù)資料
型號: ICS843246I
廠商: Integrated Device Technology, Inc.
英文描述: FEMTOCLOCKS⑩ CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER W/INTEGRATED FANOUT BUFFER
中文描述: FEMTOCLOCKS⑩晶體至3.3的LVPECL頻率合成瓦/扇出緩沖器集成
文件頁數(shù): 12/17頁
文件大小: 345K
代理商: ICS843246I
IDT
/ ICS
3.3V LVPECL FREQUENCY SYNTHESIZER
12
ICS843246BGI REV. A AUGUST 2, 2007
ICS843246I
FEMTOCLOCKS CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER W/FANOUT BUFFER
P
OWER
C
ONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS843246I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843246I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE:
Please refer to Section 3 for details on calculating power dissipated in the load.
·
·
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 180mA =
623.7mW
Power (outputs)
MAX
=
30mW/Loaded Output pair
If all outputs are loaded, the total power is 6* 30mW =
180mW
Total Power
_MAX
(3.465V, with all outputs switching) =
623.7
mW + 180mW =
803.7mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM
devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA
* Pd_total + T
A
Tj = Junction Temperature
θ
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA
must be used. Assuming no air
flow and a multi-layer board, the appropriate value is 37°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.804W * 37°C/W = 114.7°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
T
ABLE
7. T
HERMAL
R
ESISTANCE
θ
JA
FOR
24-P
IN
TSSOP, E-P
AD
F
ORCED
C
ONVECTION
θ
JA
by Velocity (Meters per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
37°C/W
31°C/W
30°C/W
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