參數(shù)資料
型號(hào): ICS843001BGI
英文描述: FEMTOCLOCKS⑩ CRYSTAL-TO-3.3V LVPECL CLOCK GENERATOR
中文描述: FEMTOCLOCKS⑩晶體至3.3V的LVPECL時(shí)鐘發(fā)生器
文件頁(yè)數(shù): 8/13頁(yè)
文件大?。?/td> 233K
代理商: ICS843001BGI
843001BKI
www.icst.com/products/hiperclocks.html
REV. A OCTOBER 6, 2005
8
Integrated
Circuit
Systems, Inc.
ICS843001BI
F
EMTO
C
LOCKS
C
RYSTAL
-
TO
-
3.3V LVPECL C
LOCK
G
ENERATOR
PRELIMINARY
P
OWER
C
ONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS843001BI.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843001BI is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE:
Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 60mA =
207.9mW
Power (outputs)
MAX
=
30mW/Loaded Output pair
Total Power
_MAX
(3.465V, with all outputs switching) =
207.9mW + 30mW =
237.9mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM
devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA
* Pd_total + T
A
Tj = Junction Temperature
θ
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
must be used. Assuming a
moderate air flow of 1 meter per second and a multi-layer board, the appropriate value is 90.5°C/W per Table 7A below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.238W * 90.5°C/W = 106.5°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
T
ABLE
7A. T
HERMAL
R
ESISTANCE
θ
JA
FOR
8-
PIN
TSSOP, F
ORCED
C
ONVECTION
θ
JA
by Velocity (Meters per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
101.7°C/W
90.5°C/W
89.8°C/W
T
ABLE
7B.
θ
JA
VS
. A
IR
F
LOW
T
ABLE
FOR
16 L
EAD
VFQFN
θ
JA
at 0 Air Flow (Linear Feet per Minute)
0
Multi-Layer PCB, JEDEC Standard Test Boards
51.5°C/W
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