
3
FN3020.7
July 28, 2005
Absolute Maximum Ratings
Thermal Information
V
CC
to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < V
CC
< 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . .(V
CC
-0.3V) < V+ < 12V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V)
Input Voltages
T1
IN
, T2
IN
. . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V
IN
< (V+ +0.3V)
R1
IN
, R2
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
30V
Output Voltages
T1
OUT
, T2
OUT
. . . . . . . . . . . . .(V- -0.3V) < V
TXOUT
< (V+ +0.3V)
R1
OUT
, R2
OUT
. . . . . . . . . (GND -0.3V) < V
RXOUT
< (V
CC
+0.3V)
Short Circuit Duration
T1
OUT
, T2
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
R1
OUT
, R2
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
Operating Conditions
Temperature Ranges
ICL232C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
o
C to 70
o
C
ICL232I. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
o
C to 85
o
C
ICL232M. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55
o
C to 125
o
C
Thermal Resistance (Typical, Note 1)
CERDIP Package . . . . . . . . . . . . . . . . .
PDIP Package. . . . . . . . . . . . . . . . . . . .
SOIC Package . . . . . . . . . . . . . . . . . . .
Maximum Junction Temperature
Plastic Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
o
C
Ceramic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
o
C
Maximum Storage Temperature Range . . . . . . . . . . -65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
o
C
θ
JA
(
o
C/W)
80
100
100
θ
JC
(
o
C/W)
18
N/A
N/A
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θ
JA
is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
Test Conditions: V
CC
= +5V
±
10%, T
A
= Operating Temperature Range. Test Circuit as in Figure 8 Unless
Otherwise Specified
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Transmitter Output Voltage Swing, T
OUT
T1
OUT
and T2
OUT
Loaded with 3k
to
Ground
±
5
±
9
±
10
V
Power Supply Current, I
CC
Outputs Unloaded, T
A
= 25
o
C
-
5
10
mA
T
IN
, Input Logic Low, V
lL
-
-
0.8
V
T
IN
, Input Logic High, V
lH
2.0
-
-
V
Logic Pullup Current, I
P
T1
IN
, T2
IN
= 0V
-
15
200
μ
A
RS-232 Input Voltage Range, V
IN
-30
-
+30
V
Receiver Input Impedance, R
IN
V
IN
=
±
3V
V
CC
= 5V, T
A
= 25
o
C
V
CC
= 5V, T
A
= 25
o
C
3.0
5.0
7.0
k
Receiver Input Low Threshold, V
lN
(H-L)
0.8
1.2
-
V
Receiver Input High Threshold, V
IN
(L-H)
-
1.7
2.4
V
Receiver Input Hysteresis, V
HYST
0.2
0.5
1.0
V
TTL/CMOS Receiver Output Voltage Low, V
OL
I
OUT
= 3.2mA
-
0.1
0.4
V
TTL/CMOS Receiver Output Voltage High, V
OH
I
OUT
= -1.0mA
3.5
4.6
-
V
Propagation Delay, t
PD
RS-232 to TTL
-
0.5
-
μ
s
Instantaneous Slew Rate, SR
C
L
= 10pF, R
L
= 3k
, T
A
= 25
o
C
(Notes 2, 3)
-
-
30
V/
μ
s
Transition Region Slew Rate, SR
T
R
L
= 3k
, C
L
= 2500pF Measured
from +3V to -3V or -3V to +3V
-
3
-
V/
μ
s
Output Resistance, R
OUT
V
CC
= V+ = V- = 0V, V
OUT
=
±
2V
300
-
-
RS-232 Output Short Circuit Current, I
SC
T1
OUT
or T2
OUT
Shorted to GND
-
±
10
-
mA
NOTES:
2. Guaranteed by design.
3. See Figure 4 for definition.
ICL232