參數(shù)資料
型號: IBM25PPC750L-GB533DD2ST
英文描述: Microprocessor
中文描述: 微處理器
文件頁數(shù): 31/50頁
文件大?。?/td> 516K
代理商: IBM25PPC750L-GB533DD2ST
5/20/99
Version 1.51
PowerPC 740 and PowerPC 750 Datasheet
Page 27
PowerPC 740 and PowerPC 750 Embedded Microprocessor
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L
Mechanical Dimensions of the 255 CBGA Package
Figure 14. Mechanical Dimensions and Bottom Surface Nomenclature of the 255 CBGA
Package
NOTES:
1.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
DIMENSIONS IN MILLIMETERS.
TOP SIDE A1 CORNER INDEX IS A
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING FROM
2.
3.
DIM
A
A1
A2
b
D
D1
e
E
E1
MIN
2.45
0.80
0.90
0.82
21.00 BSC
5.443 BSC
1.27 BSC
21.00 BSC
8.075 BSC
MAX
3.00
1.00
1.10
0.93
MILLIMETERS
A
A1
A2
C
0.15 C
B
C
C
255X
e
1 2 3 4 5 6 7 8 9 10111213141516
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
e/2
A
0.3
0.15
b
e/2
0.2
D
2X
A1 CORNER
E
E1
D1
0.2
2X
B
A
There is no ball
in the A01 position
A1 CORNER
Top View
X-ray view of balls
from top of package
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